Patents by Inventor Logeeswaran Veerayah Jayaraman
Logeeswaran Veerayah Jayaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945713Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.Type: GrantFiled: July 8, 2019Date of Patent: April 2, 2024Assignee: INVENSENSE, INC.Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
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Patent number: 11738994Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: December 13, 2022Date of Patent: August 29, 2023Assignee: InvenSense, Inc.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20230107211Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: December 13, 2022Publication date: April 6, 2023Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11548780Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: November 1, 2021Date of Patent: January 10, 2023Assignee: InvenSense, Inc.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20220348455Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.Type: ApplicationFiled: July 15, 2022Publication date: November 3, 2022Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
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Publication number: 20220048760Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: November 1, 2021Publication date: February 17, 2022Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11186479Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: August 21, 2019Date of Patent: November 30, 2021Assignee: INVENSENSE, INC.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11073531Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.Type: GrantFiled: August 21, 2019Date of Patent: July 27, 2021Assignee: INVENSENSE, INC.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20210053819Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: August 21, 2019Publication date: February 25, 2021Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20210055321Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.Type: ApplicationFiled: August 21, 2019Publication date: February 25, 2021Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 10505006Abstract: A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.Type: GrantFiled: July 24, 2018Date of Patent: December 10, 2019Assignee: InvenSense, Inc.Inventors: Bongsang Kim, Jongwoo Shin, Joseph Seeger, Logeeswaran Veerayah Jayaraman, Houri Johari-Galle
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Publication number: 20190330052Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.Type: ApplicationFiled: July 8, 2019Publication date: October 31, 2019Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
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Patent number: 10384930Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.Type: GrantFiled: April 26, 2017Date of Patent: August 20, 2019Assignee: INVENSENSE, INC.Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
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Publication number: 20190035905Abstract: A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.Type: ApplicationFiled: July 24, 2018Publication date: January 31, 2019Inventors: Bongsang KIM, Jongwoo SHIN, Joseph SEEGER, Logeeswaran Veerayah JAYARAMAN, Houri JOHARI-GALLE
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Publication number: 20180312396Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.Type: ApplicationFiled: April 26, 2017Publication date: November 1, 2018Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
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Publication number: 20180161998Abstract: A blade is described. This blade includes a substrate having two surfaces that meet at a cutting edge of the blade. At a given location along a length of the cutting edge, the two surfaces are at an angle with respect to one another. Moreover, angles between the two surfaces are different at at least two locations along the length of the blade. In particular, the angles between the two surfaces may vary along the length of the blade. Furthermore, the blade may include islands having top surfaces positioned at other locations along the length of the blade. These islands may protrude above the cutting edge to protect skin of a user when the blade is used to cut hair. In addition, the islands may include fluidic channels that provide a fluid (such as air or a lubricant) at the top surfaces of the islands when the blade is used.Type: ApplicationFiled: February 12, 2018Publication date: June 14, 2018Applicant: The Regents of the University of CaliforniaInventors: M. Saif Islam, Logeeswaran Veerayah Jayaraman
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Publication number: 20160016322Abstract: A blade is described. This blade includes a substrate having two surfaces that meet at a cutting edge of the blade. At a given location along a length of the cutting edge, the two surfaces are at an angle with respect to one another. Moreover, angles between the two surfaces are different at at least two locations along the length of the blade. In particular, the angles between the two surfaces may vary along the length of the blade. Furthermore, the blade may include islands having top surfaces positioned at other locations along the length of the blade. These islands may protrude above the cutting edge to protect skin of a user when the blade is used to cut hair. In addition, the islands may include fluidic channels that provide a fluid (such as air or a lubricant) at the top surfaces of the islands when the blade is used.Type: ApplicationFiled: March 14, 2014Publication date: January 21, 2016Applicant: The Regents of the University of CaliforniaInventors: M. Saif Islam, Logeeswaran Veerayah Jayaraman
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Publication number: 20110036396Abstract: One embodiment of the present invention provides a process for fabricating multiple devices on a single substrate based on a structure transfer process. During operation, the process starts by forming structures of multiple devices on a first substrate. The process then bonds the structures of the multiple devices onto a second substrate. Next, the process transfers the multiple devices from the first substrate onto the second substrate by fracturing the structures of the multiple devices off the first substrate, wherein the transferred devices preserve physical orientation and material properties of the said fabricated structures.Type: ApplicationFiled: April 30, 2009Publication date: February 17, 2011Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Logeeswaran Veerayah Jayaraman, Aaron M. Katzenmeyer, M. Saif Islam