Patents by Inventor Loic Deneuville

Loic Deneuville has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6581446
    Abstract: A method for determining the adhesion strength of any HVOF-coating/substrate system. This method applies a spherical indentor to the coated part in a loading-unloading cycle. During the loading phase, the substrate deforms plastically. During the unloading phase, the elastic-plastic mismatch between coating and substrate material properties gives rise to a tensile stress normal to the interface. This leads to delamination for a sufficient indentation load. A hybrid numerical-experimental approach calculates the interfacial adhesion. The threshold load for delamination is found experimentally. A finite element model calculates the corresponding adhesion stress for delamination. This method enables the quantitative evaluation of the adhesion for any coating/substrate interface, regardless of bond strength.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: June 24, 2003
    Assignee: The University of Houston
    Inventors: Loic Deneuville, Kenneth W. White, Krishnaswamy Ravi-Chandar