Abstract: A composition derived from the acid treatment of ashes obtained after heat treatment of selected plants or plant material is provided. The selected plants accumulate metal from the platinum group (platinoids). The compositions can be used to produce catalysts for performing various organic synthesis reactions.

Abstract: The present invention relates to an antibacterial food composition comprising a Propolis extract and a Vaccinium macrocarpon cranberry extract.

Abstract: A composition derived from the acid treatment of ashes obtained after heat treatment of selected plants or plant material is provided. The selected plants accumulate metal from the platinum group (platinoids). The compositions can be used to produce catalysts for performing various organic synthesis reactions.

Abstract: The present invention relates to an anti-inflammatory composition comprising a plant extract and a propolis extract.

Abstract: The present invention relates to an anti-inflammatory composition comprising a plant extract and a propolis extract.

Abstract: The present invention relates to an antibacterial food composition comprising a Propolis extract and a Vaccinium macrocarpon cranberry extract.

Abstract: A semiconductor electronic device is disclosed, which includes a die of a semiconductor material and a holder connected electrically together by wire leads of copper, the semiconductor material die being formed with a plurality of contact pads; the device being characterized by having a welding stud bump of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad in said plurality, each copper wire lead being welded with one end on a stud bump and with the other end to said holder. This electronic device is highly reliable and can be fabricated simply at a low cost.

Abstract: A package for a semiconductor device, comprising a leadframe on which at least one semiconductor chip is arranged, the semiconductor chip being connected to the leadframe by conducting leads and at least one ground lead; the ground lead is connected between the top of the semiconductor chip and a recessed region of the leadframe.

Abstract: A method for forming and bonding a metal bump on a metal pad of an integrated circuit and successively stamping a vertex of the bonded metal bump is performed using the same capillary tool. The dielectric and refractory tip of the capillary tool ends with a flat surface forming a sharp edge adjacent a concave mouth formed therein. A preformed metal ball held in the concave mouth is bonded to the metal pad of the integrated circuit. The method further includes the step of retracting the capillary tool from the bonded metal bump while allowing free movement of the capillary tool relative to the metal wire passing through an axial conduit of the capillary tool. Relative movement of the metal wire is blocked by clamping the metal wire as soon as the capillary tool is pulled off the bonded metal bump. The capillary tool is then laterally shifted for breaking off the metal wire.