Patents by Inventor Lois Yong

Lois Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dosage regimens for HCV combination therapy
    Patent number: 8822496
    Abstract: The present invention relates to therapeutic combinations comprising (a) Compound (1), or a pharmaceutically acceptable salt thereof, as herein described, (b) an interferon alfa and (c) ribavirin and particular regimens for administering this combination. Compound (1) is a selective and potent inhibitor of the HCV NS3 serine protease. The present invention also relates to methods of using such therapeutic combinations for treating HCV infection or alleviating one or more symptoms thereof in a patient.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: September 2, 2014
    Assignee: Boehringer Ingelheim International GmbH
    Inventors: Carla Haefner, Gerhard Steinmann, Jerry O. Stern, Chan-Loi Yong
  • DOSAGE REGIMENS FOR HCV COMBINATION THERAPY
    Publication number: 20110268700
    Abstract: The present invention relates to therapeutic combinations comprising (a) Compound (1), or a pharmaceutically acceptable salt thereof, as herein described, (b) an interferon alfa and (c) ribavirin and particular regimens for administering this combination. Compound (1) is a selective and potent inhibitor of the HCV NS3 serine protease. The present invention also relates to methods of using such therapeutic combinations for treating HCV infection or alleviating one or more symptoms thereof in a patient.
    Type: Application
    Filed: October 27, 2010
    Publication date: November 3, 2011
    Applicant: BOEHRINGER INGELHEIM INTERNATIONAL GMBH
    Inventors: Carla HAEFNER, Gerhard STEINMANN, Jerry O. STERN, Chan-Loi YONG
  • Integrated circuit with test pad structure and method of testing
    Patent number: 6937047
    Abstract: A semiconductor device has a large number of bond pads on the periphery for wirebonding. The semiconductor device has a module as well as other circuitry, but the module takes significantly longer to test than the other circuitry. A relatively small number of the bond pads, the module bond pads, are required for the module testing due, at least in part, to the semiconductor device having a built-in self-test (BIST) circuitry. The functionality of these module bond pads is duplicated on the top surface of and in the interior of the semiconductor device with module test pads that are significantly larger than the bond pads on the periphery. Having large pads for testing allows longer probe needles, thus increasing parallel testing capability. Duplicating the functionality is achieved through a test pad interface so that the module bond pads and the module test pads do not have to be shorted together.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: August 30, 2005
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Tu-Anh Tran, Richard K. Eguchi, Peter R. Harper, Chu-Chung Lee, William M. Williams, Lois Yong
  • Integrated circuit with test pad structure and method of testing
    Publication number: 20050030055
    Abstract: A semiconductor device has a large number of bond pads on the periphery for wirebonding. The semiconductor device has a module as well as other circuitry, but the module takes significantly longer to test than the other circuitry. A relatively small number of the bond pads, the module bond pads, are required for the module testing due, at least in part, to the semiconductor device having a built-in self-test (BIST) circuitry. The functionality of these module bond pads is duplicated on the top surface of and in the interior of the semiconductor device with module test pads that are significantly larger than the bond pads on the periphery. Having large pads for testing allows longer probe needles, thus increasing parallel testing capability. Duplicating the functionality is achieved through a test pad interface so that the module bond pads and the module test pads do not have to be shorted together.
    Type: Application
    Filed: August 5, 2003
    Publication date: February 10, 2005
    Inventors: Tu-Anh Tran, Richard Eguchi, Peter Harper, Chu-Chung Lee, William Williams, Lois Yong
  • Method for administering BIRB 796 BS
    Publication number: 20030118575
    Abstract: Disclosed are methods of administering BIRB 796 BS, a p38 MAPK inhibitor, at particular dosages.
    Type: Application
    Filed: December 6, 2002
    Publication date: June 26, 2003
    Applicant: Boehringer Ingelheim Pharmaceuticals, Inc.
    Inventors: Peter M. Grob, Jeffrey B. Madwed, Christopher Pargellis, Chan Loi Yong