Patents by Inventor Lok A. Lei

Lok A. Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional, low friction vasoocclusive coil, and method of manufacture
    Patent number: 6171326
    Abstract: The three dimensional, low friction vasoocclusive coil has a distal portion that is three dimensionally shaped, and a proximal portion that is linear or helically shaped. The distal three dimensional portion will form a basket for filling the anatomical cavity at the site in the vasculature to be treated, while the proximal portion will fill and reinforce the basket. The vasoocclusive device is formed from at least one strand of a flexible material formed to have an a first inoperable, substantially linear configuration for insertion into and through a catheter or cannula to a desired portion of the vasculature to be treated, and a second operable, three dimensional configuration for occluding the desired portion of the vasculature to be treated.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: January 9, 2001
    Assignee: Micrus Corporation
    Inventors: David A. Ferrera, Daniel R. Kurz, Peter Wilson, Crystal K. Sein-Lwyn, Lok A. Lei