Patents by Inventor Lok Fung Chow

Lok Fung Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating compositions
    Patent number: 9869026
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: January 16, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: David S. Laitar, Crystal P. L. Li, Andy Lok-Fung Chow
  • Pharmaceutical composition containing cyclometalated N-heterocyclic carbene complexes for cancer treatment
    Patent number: 9822139
    Abstract: The present disclosure is related to a pharmaceutical composition for treatment of cancer comprising a cyclometalated N-heterocyclic carbene complex. The cyclometalated N-heterocyclic carbene complex contains a gold(III) or a platinum(II) atom. The pharmaceutical composition possesses anti-cancer activity such as the induction of cell death, inhibition of cellular proliferation, inhibition of topoisomerase and/or poisoning of topoisomerase.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: November 21, 2017
    Assignee: THE UNIVERSITY OF HONG KONG
    Inventors: Chi Ming Che, Raymond Wai-Yin Sun, Lok Fung Chow, Jing Yan
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9809883
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Electroless copper plating compositions
    Patent number: 9702046
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: July 11, 2017
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: David S. Laitar, Crystal P. L. Li, Andy Lok-Fung Chow
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9611550
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: February 17, 2013
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • ELECTROLESS COPPER PLATING COMPOSITIONS
    Publication number: 20160122876
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Application
    Filed: January 12, 2016
    Publication date: May 5, 2016
    Inventors: David S. LAITAR, Crystal P. L. LI, Andy Lok-Fung CHOW
  • ELECTROLESS COPPER PLATING COMPOSITIONS
    Publication number: 20160017498
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 21, 2016
    Inventors: David S. LAITAR, Crystal P. L. LI, Andy Lok-Fung CHOW
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20150376795
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: July 10, 2015
    Publication date: December 31, 2015
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20140178572
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: February 17, 2013
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Andy Lok-Fung CHOW, Dennis Kwok-Wai YEE, Crystal P. L. LI
  • PHARMACEUTICAL COMPOSITION CONTAINING CYCLOMETALATED N-HETEROCYCLIC CARBENE COMPLEXES FOR CANCER TREATMENT
    Publication number: 20130324511
    Abstract: The present disclosure is related to a pharmaceutical composition for treatment of cancer comprising a cyclometalated N-heterocyclic carbene complex. The cyclometalated N-heterocyclic carbene complex contains a gold(III) or a platinum(II) atom. The pharmaceutical composition possesses anti-cancer activity such as the induction of cell death, inhibition of cellular proliferation, inhibition of topoisomerase and/or poisoning of topoisomerase.
    Type: Application
    Filed: August 7, 2013
    Publication date: December 5, 2013
    Applicant: THE UNIVERSITY OF HONG KONG
    Inventors: Chi Ming Che, Raymond Wai-Yin Sun, Lok Fung Chow, Jing Yan
  • Pharmaceutical composition containing cyclometalated N-heterocyclic carbene complexes for cancer treatment
    Patent number: 8530659
    Abstract: The present disclosure is related to a pharmaceutical composition for treatment of cancer comprising a cyclometalated N-heterocyclic carbene complex. The cyclometalated N-heterocyclic carbene complex contains a gold(III) or a platinum(II) atom. The pharmaceutical composition possesses anti-cancer activity such as the induction of cell death, inhibition of cellular proliferation, inhibition of topoisomerase and/or poisoning of topoisomerase.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: September 10, 2013
    Assignee: The University of Hong Kong
    Inventors: Chi Ming Che, Raymond Wai-Yin Sun, Lok Fung Chow, Jing Yan
  • PHARMACEUTICAL COMPOSITION CONTAINING CYCLOMETALATED N-HETEROCYCLIC CARBENE COMPLEXES FOR CANCER TREATMENT
    Publication number: 20110098264
    Abstract: The present disclosure is related to a pharmaceutical composition for treatment of cancer comprising a cyclometalated N-heterocyclic carbene complex. The cyclometalated N-heterocyclic carbene complex contains a gold(III) or a platinum(II) atom. The pharmaceutical composition possesses anti-cancer activity such as the induction of cell death, inhibition of cellular proliferation, inhibition of topoisomerase and/or poisoning of topoisomerase.
    Type: Application
    Filed: October 27, 2010
    Publication date: April 28, 2011
    Applicant: THE UNIVERSITY OF HONG KONG
    Inventors: Chi Ming Che, Raymond Wai-Yin Sun, Lok Fung Chow, Jing Yan