Abstract: The micro grating structure is provided. The micro grating structure includes a substrate; a first supporting structure and a second supporting structure; a first structure post and a second structure post, wherein the first structure post and the second structure post are mounted on the substrate between the first supporting structure and the second supporting structure; and a grating mounted between the first structure post and the second structure post and comprising a first, a second, a third and a fourth torsion beams, wherein the first and the second torsion beams are connected to the first and the second supporting structures respectively, the third and the fourth torsion beams are connected to the first and the second structure posts respectively, and the first, the second, the third and the fourth torsion beams are twisted by an electrostatic force so as to enable the grating to be inclined at an angle with respect to the substrate.

Abstract: A motion sensing system utilizing piezoelectric laminates with predetermined surface electrode patterns disposed thereon utilizes a frequency selector to pass motion waves of predetermined frequencies and an electrical circuit for processing the electrical signals for transmission to an activating device for appropriate activation. In particular, the frequency selector is a low frequency bandpass filter for free-fall acceleration wave frequencies. By directing appropriate action, the present invention increases the applicability of the device upon which it is mounted (e.g., for military or other hostile environment use), decreases the possibility of damage, and lengthens its useful life.

Abstract: A motion sensing system utilizing piezoelectric laminates with predetermined surface electrode patterns disposed thereon utilizes a frequency selector to pass motion waves of predetermined frequencies and an electrical circuit for processing the electrical signals for transmission to an activating device for appropriate activation. In particular, the frequency selector is a low frequency bandpass filter for free-fall acceleration wave frequencies. By directing appropriate action, the present invention increases the applicability of the device upon which it is mounted (e.g., for military or other hostile environment use), decreases the possibility of damage, and lengthens its useful life.

Abstract: A tunable laser system is provided. The tunable laser system includes a light source, a grating, a corner mirror array, and a receiver. In which, the light source emits a beam, and the grating is located in front of the light source for reflecting the beam to form a first reflective beam. Also, the corner mirror array is located in front of the grating for receiving the first reflective beam and forms a second reflective beam accordingly. In addition, the receiver is used to receive a third reflective beam formed from reflecting the second reflective beam through the grating.

Abstract: This invention discloses a micro-stamping method for photoelectric process. First of all, in this invention, the micro-stamping method provides a stamp, an ink, an inkpad and a substrate, wherein the stamp or the inkpad having a specific raised pattern and the ink is one element of the group consisting of red ink, green ink and blue ink. Further, by adherence of the ink to the stamp, the specific pattern can be transferred to the surface of the substrate. Furthermore, this micro-stamping method comprises an ink adherence process, a positioning process, a pattern transferring process and a fixation process, and the above-mentioned processes will repeat until the three inks, such as red ink, green ink and blue ink, all adhered and fixed on the predetermined places of substrate.

Abstract: The micro grating structure is provided. The micro grating structure includes a substrate; a first supporting structure and a second supporting structure; a first structure post and a second structure post, wherein the first structure post and the second structure post are mounted on the substrate between the first supporting structure and the second supporting structure; and a grating mounted between the first structure post and the second structure post and comprising a first, a second, a third and a fourth torsion beams, wherein the first and the second torsion beams are connected to the first and the second supporting structures respectively, the third and the fourth torsion beams are connected to the first and the second structure posts respectively, and the first, the second, the third and the fourth torsion beams are twisted by an electrostatic force so as to enable the grating to be inclined at an angle with respect to the substrate.

Abstract: A grating manufactured by a micro-structure gap control technique is provided in this invention. The grating includes a first structural part, a second structural part and a substrate. The first structural part includes a first micro-structure and a concavity, the second structural part includes a second micro-structure and an island structure located within the concavity, wherein a gap exists between the inland structure and the concavity. Further, the substrate is bonded to the first structural part and the second structural part for supporting the first structural part and the second structural part.

Abstract: A biological cell test method and apparatus employs a conventional perforated cell carrier which has a plurality of holes. Each hole has two metal electrodes. A cell is disposed in the hole to contact the two electrodes. The electrodes are connected to electric current or voltage. The electric current or field flows from one electrode through the cell to another electrode. Through the inherent impedance, inductance or capacitance of the cell, the presence or property reactions of the cell may be detected.

Abstract: A method for manufacturing a grating is provided. The method includes the steps as follows: a) forming a first insulating layer on a substrate; b) forming a silicon oxide layer on the first insulating layer; c) forming and hard baking a photoresist on the silicon oxide layer for defining a plurality of specific zones; d) etching the first insulating layer and the silicon oxide layer within the specific zones respectively for forming a plurality of concaves; e) forming a second insulating layer on the silicon oxide layer; f) defining a plurality of grating zones onto the second insulating layer, and forming an adhesive layer and a conductive layer on the grating zones in sequence; g) removing parts of the second insulating layer located outside of the grating zones; and h) removing the silicon oxide layer for exposing a plurality of grating structures within the grating zone.

Abstract: A method of pre-etching a glass substrate for reducing a post-releasing time is provided. The method includes steps of: The glass substrate, a micro-structure and a silicon substrate are provided. The glass substrate is connected with the micro-structure. A first etching process is performed on the glass substrate for reducing the area of the glass substrate connected with the micro-structure. The micro-structure is connected with the silicon substrate and a second etching process is performed on the glass substrate for removing the micro-structure from the glass substrate.

Abstract: A biological cell test method and apparatus employs a conventional perforated cell carrier which has a plurality of holes. Each hole has two metal electrodes. A cell is disposed in the hole to contact the two electrodes. The electrodes are connected to electric current or voltage. The electric current or field flows from one electrode through the cell to another electrode. Through the inherent impedance, inductance or capacitance of the cell, the presence or property reactions of the cell may be detected.

Abstract: A microarray biochip includes a transparent substrate and a plurality of indented reaction zones formed on the substrate. Each reaction zone has a plurality of adhesive units of a preset height formed thereon in an array fashion, and a top surface to form a first adhesive surface and lateral side surfaces to form second adhesive surfaces. The invention can effectively hold sample solution and retain end label products after calorimetric or fluorometric reaction, and increases reaction area and be adopted for use in optical or reflective detection devices.

Abstract: A microarray biochip workstation allowing positioning of chips, immobilization of molecules, mixing of sample solution, molecular interactions and washing and processing qualitative and quantitative analyses consists of a positioning device for holding a biochip, a mixing device for acting on the sample solution applied on the biochip, a pumping device for removing the sample solution from the biochip surface that does not react, and a reading device for detecting reaction results of the biochip. The workstation thus constructed provides an integrated and effective work interface.

Abstract: A mixing apparatus for biochips consists of a oscillation unit with controllable vibration frequency, a transmission section driven by the oscillation unit for transferring vibration of the oscillation unit, and a mixing unit connecting to and driven by the transmission section and locating at a selected distance above the biochip surface. The oscillation unit may generate vibration of a specific frequency and the vibration frequency, amplitude and duration may be controlled for effectively mixing and separating sample solution rapidly, simply and more economically.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: A sensor system of a surface plasmon resonance (SPR) for analyzing a characteristic of a substance and the measuring method thereof are provided. The system includes an optical device for generating a first light beam and a second light beam in sequence; a sensor device for respectively generating a first plasmon wave and a second plasmon wave in response to an optical characteristic change of the first light beam and the second light beam with respective to the substance, in which a resonance is generated from the first plasmon wave and the second plasmon wave respectively generating a first reflective signal and a second reflective signal; and a measuring device for measuring spectra of the first reflective signal and the second reflective signal and obtaining the measured value which is substituted into an operational formula to calculate a reference value used for analyzing the characteristic of the substance.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: A motion sensing system utilizing piezoelectric laminates with predetermined surface electrode patterns disposed thereon utilizes a frequency selector to pass motion waves of predetermined frequencies and an electrical circuit for processing the electrical signals for transmission to an activating device for appropriate activation. In particular, the frequency selector is a low frequency bandpass filter for free-fall acceleration wave frequencies. By directing appropriate action, the present invention increases the applicability of the device upon which it is mounted (e.g., for military or other hostile environment use), decreases the possibility of damage, and lengthens its useful life.

Abstract: An image sensor apparatus for converting an incident light into electric signal is disclosed. The apparatus has a color separation layer that comprises a body layer for receiving incident light. A surface of the body layer is covered by a two-dimensional microlens array of lenslets, and the other surface of the body layer is covered by a blazed diffraction grating layer. A zeroth-order reflection layer is disposed behind the color separation layer along the path of the incident light for reflecting away zeroth-order component of the incident light. An image sensor array is disposed further behind the zeroth-order reflection layer along the path of the incident light and comprises a two-dimensional array of light-sensing cells.