Abstract: An embodiment includes a method including forming a first interconnect structure over a first substrate, the first interconnect structure including dielectric layers and metallization patterns therein. The method also includes forming a redistribution via and a redistribution pad over the first interconnect structure, the redistribution via and the redistribution pad being electrically coupled to at least one of the metallization patterns of the first interconnect structure, the redistribution via and the redistribution pad having a same material composition. The method also includes forming a warpage control dielectric layer over the redistribution pad. The method also includes forming a bond via and a bond pad over the redistribution pad, the bond pad being in the warpage control dielectric layer, the bond via being electrically coupled to the redistribution pad.

Abstract: In an example embodiment, a system includes an inverter configured to operate in at least one of a charging mode or a drive mode, a cascaded direct current (DC)-DC converter, the DC-DC converter including a first portion of the inverter and at least one controller configured to selectively couple the first portion of the inverter to a first portion of the cascaded DC-DC converter during the charging mode, and selectively couple the inverter to a second portion of the cascaded DC-DC converter during the drive mode.

Abstract: A method with which mechanical properties of the interface of the fiber reinforced thermoplastic resin matrix composite material can be improved by conducting grafting on surfaces of materials. A carbon fiber (CF) and a polymethyl methacrylate resin (PMMA) are subjected to interface modification treatment to introduce active carboxyl groups to the surfaces of the materials. Then, hexamethylene diisocyanate (HDI) is used as a coupling layer for connecting the carboxyl groups on the surfaces of the carbon fiber and on the surfaces of the polymethyl methacrylate resin to form a “molecular bridge”. Accordingly, the interface binding force between the resin and the fiber is improved by chemical grafting. A modified carbon fiber reinforced polymethyl methacrylate composite material sample (CF/PMMA) is prepared by a thin film lamination method, and the composite material sample prepared is subjected to a microscopic verification testing of the validity of the method provided in the present disclosure.

Abstract: A tooling and method for flexible through connection of a double-liner water heater. The tooling includes a transition shaft, a tooling connecting plate and a fastening screw. The method includes: allowing a shaft head of the transition shaft to be in fit with an inner surface of an outer flange of a lower liner for welding; allowing an end hole to be in fit with an outer surface of an inner flange of an upper liner for welding; after welding seams are cooled, removing the tooling, and enameling the upper and liners; forming through-flexible connection between the inner and outer flanges; and firmly fitting the upper and lower liners together with two steel strips to ensure that a gap between the upper and lower liners is not greater than 7 mm.

Abstract: An embodiment includes a method including forming a first interconnect structure over a first substrate, the first interconnect structure including dielectric layers and metallization patterns therein. The method also includes forming a redistribution via and a redistribution pad over the first interconnect structure, the redistribution via and the redistribution pad being electrically coupled to at least one of the metallization patterns of the first interconnect structure, the redistribution via and the redistribution pad having a same material composition. The method also includes forming a warpage control dielectric layer over the redistribution pad. The method also includes forming a bond via and a bond pad over the redistribution pad, the bond pad being in the warpage control dielectric layer, the bond via being electrically coupled to the redistribution pad.

Abstract: A method includes forming a function circuit on a semiconductor substrate of a device die, wherein the function circuit is in a functional circuit zone of the device die, forming a passive device over the semiconductor substrate, wherein the passive device is in a passive device zone of the device die, forming a first plurality of bond pads in the functional circuit zone and at a surface of the device die, wherein the first plurality of bond pads have a first pattern density; and forming a second plurality of bond pads in the passive device zone and at the surface of the device die. The second plurality of bond pads have a second pattern density lower than the first pattern density.

Abstract: A transparent display device includes a transparent display panel and a functional film. The transparent display panel includes a transparent substrate and a pixel array. The functional film is disposed on the transparent display panel. The pixel array is located between the functional film and the transparent substrate. A surface of the functional film facing away from the transparent substrate has raised microstructures. At least a portion of each of the raised microstructures extends in a first oblique direction. A size of the least a portion of each of the raised microstructures is gradually decreased along the first oblique direction. The first oblique direction forms an acute angle ? with a normal direction of the transparent substrate.

Abstract: A voltage command estimator is configured to estimate a minimum required variable DC bus voltage based on the first direct-axis current/voltage command, the first quadrature-axis current/voltage command, the second direct-axis current/voltage command, and the second quadrature-axis current/voltage command for a respective time interval. The voltage command estimator is configured to provide the estimated minimum required variable DC bus voltage to a voltage regulator to adjust the observed voltage level of the variable DC voltage bus to the estimated minimum required variable DC bus voltage to maintain the operation, as commanded by the voltage/current commands, of the first electric machine under the first variable load and the second electric machine under the second variable load at the time interval.

Abstract: A synchronization signal generation circuit and a synchronization method among a plurality of devices are proposed. The synchronization signal generation circuit includes a clock signal generator and a controller. The clock signal generator generates a reference clock signal. The controller receives an input clock signal from a host end device and generates a plurality of candidate clock signals through a plurality of counting operations based on the reference clock signal. The controller selectively transmits one of the candidate clock signals to each peripheral device according to request information corresponding to each peripheral device. The candidate clock signals and the input clock signal have mutually aligned start time points in each frame period.

Abstract: A novel frequency tunable bi-directional phased array processing consisting of variable phase shifting and amplitude adjustment which employs a vector modulator and active combiner and splitter is proposed. Advantages of the proposed bi-directional a phased array processing includes the following 1) compact size; 2) high efficiency; 3) reduced passive trace loss and power consumption; 4) active current combining; 5) high input-output isolation; 6) high resolution and precise gain control and unequal combining or splitting; 7) phase-invariant amplifier design; 8) high accuracy and high-resolution phase shifter; 9) frequency tunability, within a small frequency range and/or a large frequency range; and 10) optimal unequal combining or splitting.

Abstract: The invention provides a positioning tool and a busbar mounting method. The positioning tool includes a first mount, a second mount, a first link, a second link and a positioning base. The first mount and the second mount are configured to be mounted on opposite sides of the server cabinet, respectively. The first link and the second link are spaced apart from each other. Opposite ends of the first link are respectively pivotally connected to the first mount and the second mount. Opposite ends of the second link are respectively pivotally connected to the first mount and the second mount. The positioning base is pivotally connected to the first link and the second link. The positioning base is located between the first mount and the second mount and is configured to position the busbar.

Abstract: A context-based adaptive binary arithmetic coding (CABAC) decoder includes a bin decode circuit and a context update circuit. The bin decode circuit supports decoding of multiple bins in one cycle. The multiple bins include a first bin and a second bin. The bin decode circuit generates a bin value of the first bin according to a first set of multiple contexts, a first range and a first offset, and generates one bin value of the second bin according to a second set of multiple contexts, a second range and a second offset. The context update circuit updates the first set of multiple contexts in response to the bin value of the first bin, to generate a first set of multiple updated contexts, and updates the second set of multiple contexts in response to said one bin value of the second bin, to generate a second set of multiple updated contexts.

Abstract: A display panel includes a plurality of driving electrode regions and a plurality of wiring regions connected between the driving electrode regions. A (2n?1)th wiring region extended from a (2n?1)th driving electrode region toward a (2n)th driving electrode region has a wiring extending direction forming a first included angle with an arrangement direction, and a (2n)th wiring region extended from the (2n)th driving electrode region toward a (2n+1)th driving electrode region has a wiring extending direction forming a second included angle with the arrangement direction, and a (2n+1)th wiring region extended from the (2n+1)th driving electrode region toward a (2n+2)th driving electrode region has a wiring extending direction forming a third included angle with the arrangement direction, wherein n is a positive integer. At least one of the first included angle, the second included angle and the third included angle is positive and at least one of them is negative.

Abstract: In an example embodiment, a system includes a plurality of inverters configured to operate in at least one of a charging mode or a drive mode, a plurality of motors and at least one controller configured to selectively couple the plurality of inverters to the plurality of motors during a drive mode, and selectively couple at least one of the inverters to an alternating current (AC) source during the charging mode and decouple the at least one of the inverters from the plurality of motors during the charging mode.

Abstract: A method with which mechanical properties of the interface of the fiber reinforced thermoplastic resin matrix composite material can be improved by conducting grafting on surfaces of materials. A carbon fiber (CF) and a polymethyl methacrylate resin (PMMA) are subjected to interface modification treatment to introduce active carboxyl groups to the surfaces of the materials. Then, hexamethylene diisocyanate (HDI) is used as a coupling layer for connecting the carboxyl groups on the surfaces of the carbon fiber and on the surfaces of the polymethyl methacrylate resin to form a “molecular bridge”. Accordingly, the interface binding force between the resin and the fiber is improved by chemical grafting. A modified carbon fiber reinforced polymethyl methacrylate composite material sample (CF/PMMA) is prepared by a thin film lamination method, and the composite material sample prepared is subjected to a microscopic verification testing of the validity of the method provided in the present disclosure.

Abstract: A filter includes at least two coil assemblies, a plurality of wiring harnesses, at least one dielectric mechanical part, and at least two wiring layers disposed in a stacked manner, where each coil assembly includes a plurality of wires, and one or more wires belonging to different coil assemblies are disposed in each wiring layer; each wiring harness is coupled to two different wires of a same coil assembly, to sequentially couple the wires of each coil assembly together; and each dielectric mechanical part is located between two adjacent wiring layers, wiring layers are stacked together under effect of the dielectric mechanical part, and a volume of each dielectric mechanical part is less than a volume of interlayer space between two wiring layers that are in contact with each dielectric mechanical part.

Abstract: A first electronic controller is configured to provide control signals to the control terminals of the semiconductor switches of the first primary converter and the first secondary converter based on a commanded current or target output current (e.g., pursuant to a voltage control mode); the first electronic controller is configured to adjust or increase the output impedance or output resistance of the first secondary converter based on a first droop compensation module (or a first parallel compensation module) responsive to a current error or current difference between the target output current and the observed output current.

Abstract: An electronic controller is configured to provide control signals to the control terminals of the semiconductor switches of the primary converter and the secondary converter based on a commanded current or target output current; the electronic controller is configured to adjust the phase angle(s), between a respective pairs of semiconductor switches of the primary converter and second converter based on a deadtime compensation module responsive to a current error or current difference between the target output current and the observed output current. A low-pass filter facilitates estimation of the current error for compensation in the commanded current.

Abstract: An electronic controller is configured to adjust the duty cycle, between a respective pairs of semiconductor switches of the primary converter of a direct-current-to-direct-current converter based on reducing or minimizing one or more of the first estimated line-to-line DC offset voltage, the second estimated line-to-line DC offset voltage, and the third estimated line-to-line DC offset voltage. Further, the electronic controller is configured determines duty cycle adjustments based on oversampling (e.g., enhanced data processing with interpolation) of smoothed or integrated representation of the first estimated line-to-line DC offset voltage, the second estimated line-to-line DC offset voltage, and the third estimated line-to-line DC offset voltage.

Abstract: An intelligent lamp, a signal adaptive identification method for the intelligent lamp, and a computer-readable storage medium for implementing the method include: receiving a communication signal, and obtaining frame header data of the communication signal; and comparing the frame header data with preset reference frame header data, and if the frame header data matches the preset reference frame header data, obtaining communication data of a communication signal corresponding to the frame header data, and determining whether a time sequence of the communication data matches a communication data time sequence corresponding to the reference frame header data, and if yes, executing an instruction in the communication data of the communication signal corresponding to the frame header data.