Abstract: The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Abstract: The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.

Abstract: The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins.

Abstract: The present invention relates to a halogen-free flame retardant resin composition, a prepreg and a copper clad laminate prepared therefrom. The composition of the present invention comprises, based on the weight parts of solid components, (A) from 5 to 80 parts by weight of alkylphenol epoxy resin, (B) from 10 to 80 parts by weight of benzoxazine resin, (C) from 2 to 30 parts by weight of styrene maleic anhydride resin, (D) from 1 to 30 parts by weight of a flame retardant, and (E) from 0.5 to 100 parts by weight of an acidic filler having a pH of 2-6. The present invention further provides a prepreg and a copper clad laminate prepared from the halogen-free flame retardant resin composition.

Abstract: The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention greatly promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins.

Abstract: A self-feedback control circuit is connected to a controller area network bus for controlling a high-level output and a low-level output, comprising a controller area network driving circuit and a replica circuit. The replica circuit is connected in parallel with the controller area network driving circuit and comprises an upper feedback path and a lower feedback path. The upper feedback path and the lower feedback path are connected jointly to a common mode, and the replica circuit provides a feedback signal from the common mode such that the feedback signal is able to be respectively transmitted to two individual transistors of the controller area network driving circuit through the upper feedback path and through the lower feedback path so as to control DC level stability of the high-level output and the low-level output.

Abstract: A slope control circuit is connected between a replica circuit and a controller area network bus. The replica circuit generates an upper and a lower feedback signal. The slope control circuit receives and is driven by the feedback signals for controlling a voltage slope of a high-level output and a low-level output. The slope control circuit comprises an upper and a lower driving circuit, individually connected between the replica circuit, the high-level output and the low-level output. The upper driving circuit and the lower driving circuit respectively include at least one charging and discharging circuit. By controlling the charging and discharging circuit, the present invention controls decreasing voltage slope of the high-level output to be symmetric to increasing voltage slope of the low-level output, and delay time of the circuit switching between different operating modes to be equivalent.

Abstract: A slope control circuit is connected between a replica circuit and a controller area network bus. The replica circuit generates an upper and a lower feedback signal. The slope control circuit receives and is driven by the feedback signals for controlling a voltage slope of a high-level output and a low-level output. The slope control circuit comprises an upper and a lower driving circuit, individually connected between the replica circuit, the high-level output and the low-level output. The upper driving circuit and the lower driving circuit respectively include at least one charging and discharging circuit. By controlling the charging and discharging circuit, the present invention controls decreasing voltage slope of the high-level output to be symmetric to increasing voltage slope of the low-level output, and delay time of the circuit switching between different operating modes to be equivalent.

Abstract: A self-feedback control circuit is connected to a controller area network bus for controlling a high-level output and a low-level output, comprising a controller area network driving circuit and a replica circuit. The replica circuit is connected in parallel with the controller area network driving circuit and comprises an upper feedback path and a lower feedback path. The upper feedback path and the lower feedback path are connected jointly to a common mode, and the replica circuit provides a feedback signal from the common mode such that the feedback signal is able to be respectively transmitted to two individual transistors of the controller area network driving circuit through the upper feedback path and through the lower feedback path so as to control DC level stability of the high-level output and the low-level output.

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Abstract: A fully differential sensing apparatus and an input common mode feedback circuit are provided. The input common mode feedback circuit includes a common mode error amplifier and a plurality of adaptive conductance elements. Each adaptive conductance element behaves with a low impedance characteristic when its anode voltage is greater than its cathode voltage by a positive threshold voltage or, on the contrary, when the anode voltage of such an adaptive conductance element is lower than its cathode voltage by a negative threshold voltage, the adaptive element also behaves with a low impedance characteristic; otherwise the aforementioned adaptive conductance element behaves with a high impedance characteristic. The common mode error amplifier and a plurality of such adaptive conductance elements form a negative feedback loop to effectively maintain the input common voltage of a fully differential input amplifier, which can be used for a fully differential sensing apparatus.

Abstract: A fully differential sensing apparatus and an input common mode feedback circuit are provided. The input common mode feedback circuit includes a common mode error amplifier and a plurality of adaptive conductance elements. Each adaptive conductance element behaves with a low impedance characteristic when its anode voltage is greater than its cathode voltage by a positive threshold voltage or, on the contrary, when the anode voltage of such an adaptive conductance element is lower than its cathode voltage by a negative threshold voltage, the adaptive element also behaves with a low impedance characteristic; otherwise the aforementioned adaptive conductance element behaves with a high impedance characteristic. The common mode error amplifier and a plurality of such adaptive conductance elements form a negative feedback loop to effectively maintain the input common voltage of a fully differential input amplifier, which can be used for a fully differential sensing apparatus.

Abstract: A third order sigma-delta modulator comprises a first summing unit for receiving an input signal, a first integrator network connected to an output of the first summing unit, a second integrator network for receiving an output of the first integrator network, a second summing unit connected to an output of the second integrator network, a third integrator network connected to an output of the second summing unit, and a feed-forward path from the output of the first integrator network to an input of the second summing unit.

Abstract: A third order sigma-delta modulator comprises a first summing unit for receiving an input signal, a first integrator network connected to an output of the first summing unit, a second integrator network for receiving an output of the first integrator network, a second summing unit connected to an output of the second integrator network, a third integrator network connected to an output of the second summing unit, and a feed-forward path from the output of the first integrator network to an input of the second summing unit.

Abstract: Two osmotic stress- and ABA-responsive members of the endochitinase (EC 3.2.1.14) gene family has been isolated and identified from leaves of drought-stressed Lycopersicon chilense plants. The 966-base-pair insert of pcht28 encodes an acidic chitinase precursor with an amino-terminal signal peptide. The mature protein is predicted to have 229 amino acid residues with a relative molecular weight of 24,943 and pI value of 6.2. The same number in amino acids, molecular and PI value are predicted for the protein encoded by pchtI, despite of a slight variation in the DNA and amino acid sequences. Sequence analysis revealed that pcht28 and pchtI have a high degree of homology with class II chitinases (EC 3.2.1.14) from tobacco. Northern blot analysis indicated that these genes have evolved a completely different pattern of expression from others reported thus far. They are highly induced by both osmotic stress and the plant hormone abscisic acid.