Patents by Inventor Long Zhai

Long Zhai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088032
    Abstract: Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Vidhya Ramachandran, Chi Nung Ni, Chueh-An Hsieh, Rekha Govindaraj, Jun Zhai, Long Huang, Rohan U. Mandrekar, Saumya K. Gandhi, Zhuo Yan, Yizhang Yang, Saurabh P. Sinha, Antonietta Oliva
  • Patent number: 11041230
    Abstract: The present disclosure provides a magnesium alloy and a preparation method thereof. The magnesium alloy comprises: Al: 7.01-9.98 wt %; Zn: 0.1-1.2 wt %; Mn: 0.05-0.2 wt %; Sn: 0.3-2.5 wt %; Sm: 0.1-0.5 wt %; and a balance of Mg.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: June 22, 2021
    Assignee: CITIC DICASTAL CO., LTD
    Inventors: Zuo Xu, Guoyuan Xiong, Chunhai Liu, Lixin Huang, Yongfei Li, Long Zhai, Kedi Ding, Liguo Yang
  • Publication number: 20200399741
    Abstract: The present disclosure provides a magnesium alloy and a preparation method thereof. The magnesium alloy comprises: Al: 7.01-9.98 wt %; Zn: 0.1-1.2 wt %; Mn: 0.05-0.2 wt %; Sn: 0.3-2.5 wt %; Sm: 0.1-0.5 wt %; and a balance of Mg.
    Type: Application
    Filed: August 26, 2019
    Publication date: December 24, 2020
    Inventors: Chunhai Liu, Lixin Huang, Yongfei Li, Long Zhai, Kedi Ding, Liguo Yang
  • Patent number: 7301774
    Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: November 27, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Shao-Long Zhai, Zhi-Yong Zhou
  • Publication number: 20060120053
    Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
    Type: Application
    Filed: August 23, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Shao-Long Zhai, Zhi-Yong Zhou