Patents by Inventor Lonne L. Mays

Lonne L. Mays has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of passivating a semiconductor substrate
    Patent number: 5908316
    Abstract: A method of passivating a semiconductor substrate includes singulating (13) a semiconductor substrate (23) from a semiconductor wafer, coupling (14) a heatsink (21) to the semiconductor substrate (23), etching (15) the semiconductor substrate (23) in a chamber of an etch tool, and passivating (17) the semiconductor substrate (23) with an oxide layer (31). The semiconductor substrate (23) is kept in the chamber of the etch tool from the etching (15) step through the passivating (17) step. The etching (15) of the semiconductor substrate (23) does not substantially etch the heatsink (21), and the passivating (17) of the semiconductor substrate (23) does not substantially passivate the heatsink (21).
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: June 1, 1999
    Assignee: Motorola, Inc.
    Inventors: Hiep M. Le, Lonne L. Mays, Albert E. Tavares
  • Electronic package and method
    Patent number: 5786745
    Abstract: A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: July 28, 1998
    Assignee: Motorola, Inc.
    Inventors: Alexander J. Elliott, Lonne L. Mays
  • Semiconductor diode device with non-planar heatsink and method of manufacture
    Patent number: 5751061
    Abstract: A semiconductor diode device (10) includes two heatsinks (11, 12), a semiconductor substrate (15) having a p-n junction (35) and located between the two heatsinks (11, 12), solder (13, 14) between the heatsinks (11, 12) and the semiconductor substrate (15), and a packaging material (16) covering the semiconductor substrate (15), the solder (13, 14), and a portion of the two heatsinks (11, 12). The two heatsinks (11, 12) each have a curved surface (21, 22), which reduces tilting of the semiconductor substrate (15), reduces temperature gradients across surfaces (23, 24) of the semiconductor substrate (15), and improves the reliability of the semiconductor diode device (10). The two heatsinks (11, 12) also include protrusions (19, 20), which help to keep the packaging material (16) covering the curved surfaces (21, 22) of the heatsinks (11, 12).
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: May 12, 1998
    Assignee: Motorola, Inc.
    Inventors: Lonne L. Mays, Jean-Baptiste Martin, Hiep M. Le, James G. Lippmann
  • Mold compound
    Patent number: 5709960
    Abstract: An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: January 20, 1998
    Assignee: Motorola, Inc.
    Inventors: Lonne L. Mays, Mark D. Mosher, Alexandra Hubenko
  • Electronic surface mount device
    Patent number: 5581118
    Abstract: A surface mount package (10) includes a leadframe (14) facing away from the mounting surface such that the primary heat path is away from the mounting surface. The package may be a modified TO-220, wherein the tab (16) of the leadframe is bent down toward the mounting surface, and the leads (20) are bent down and under the package. Such an embodiment provides for a small footprint and is relatively easy to manufacture.
    Type: Grant
    Filed: June 23, 1995
    Date of Patent: December 3, 1996
    Assignee: Motorola, Inc.
    Inventor: Lonne L. Mays