Abstract: A method of producing a polyimide polymer comprising reacting at least two dianyhydride monomers with at least two diamino monomers in a first solvent under conditions appropriate to form a polyamic acid and subsequently imidized through one or more methods to a polyimide polymer.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: Black polyimides polymer and a method of synthesizing the same have been developed. The black polyimide polymer includes at least one acid monomer, at least one diamino monomer and a solvent-soluble black dye. The acid and diamino monomers having been reacting in a solvent under suitable conditions to form a polyimide precursor polymer.

Abstract: Black polyimides polymer and a method of synthesizing the same have been developed. The black polyimide polymer includes at least one acid monomer, at least one diamino monomer and a solvent-soluble black dye. The acid and diamino monomers having been reacting in a solvent under suitable conditions to form a polyimide precursor polymer.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: A process for adjusting polyimide polymer properties includes combining monomers in a reaction mass to form a polyimide precursor. A property modifying moiety which is covalently bonded to an amine is then added to the reaction mass, and the reaction between the amine bonded to the property modifying moiety and the polyimide precursor is arrested before equilibrium. The polyimide precursor is imidized to form a polyimide polymer prior to equilibrium.