Abstract: A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.

Abstract: A computer system including a chassis of substantially rectangular cross section suitable for receiving a circuit board. A rear face of the chassis includes upper and lower exhaust ports. A CPU board including one or more processors may be housed within the chassis. The expansion board is suitable for receiving a plurality of expansion cards via connectors attached to the board. The expansion board includes at least one void for facilitating air flow and is housed within the chassis wherein a rear side of the board is proximal to the rear face of the chassis between the upper and lower exhaust ports. An air moving device is positioned within the chassis for directing air flow across the expansion board toward the rear face of the chassis and, via the at least one void in the expansion card, through the upper and lower exhaust ports.