Abstract: A shielded, erasable-programmable-read-only-memory (EPROM) package is provided. A circuit carrying substrate (10), contains an area for mounting an EPROM chip (16), having conductive interconnecting patterns (12) adjacent to the chip mounting area. The EPROM chip is mounted on the circuit carrying substrate, and the pad electrodes on the EPROM chip are connected to pads on the conductive patterns of the substrate by wire bonds (17) or other means. An ultraviolet (UV) light transmitting resin (18) is transfer molded onto the circuit carrying substrate, covering the EPROM chip (16) and the wire bonds (17) so as to provide an optical path through the material to the top surface of the EPROM chip, and sealing the EPROM chip from the exterior of the package. An adherent metal coating (19) is sputtered over the transfer molded resin, and the metal coating is coated with a protective organic resin (15). Both the metal coating and the organic resin are at least partially transparent to ultraviolet light.