Patents by Inventor Loo Kean Teoh

Loo Kean Teoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection for alignment between IC die and package substrate
    Patent number: 7030772
    Abstract: In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: April 18, 2006
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Swee Peng Lee, Ajit Dubey, Leang Hua Kam, Loo Kean Teoh