Patents by Inventor Loo L. Teoh

Loo L. Teoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Boat for organic and ceramic flip chip package assembly
    Patent number: 6488158
    Abstract: A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.
    Type: Grant
    Filed: September 11, 2000
    Date of Patent: December 3, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Mohammad Khan, Raj N. Master, Maria G. Guardado, Loo L. Teoh, Ahmad Juwanda