Patents by Inventor Loon Aik Lim

Loon Aik Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAPILLARY FOR A BONDING TOOL
    Publication number: 20070125831
    Abstract: A capillary is provided for a wire bonding tool that comprises a holding portion for clamping the capillary, a conical portion at a tip of the capillary for performing bonding and a substantially frustoconical portion located between the holding portion and the conical portion. The sidewalls of the frustoconical portion form an interfacial angle that is smaller than an interfacial angle formed by the sidewalls of the conical portion so as to provide a gentle taper from the holding portion to the conical portion.
    Type: Application
    Filed: December 6, 2006
    Publication date: June 7, 2007
    Inventors: Srikanth NARASIMALU, Ning YING, Loon Aik LIM
  • Mold and method for encapsulation of electronic device
    Patent number: 6770163
    Abstract: A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: August 3, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Teng Hock Kuah, Shu Chuen Ho, Charles Joseph Vath, III, Loon Aik Lim, Man Ho Hui, Juay Sim Koh