Patents by Inventor Loon Lim

Loon Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230201775
    Abstract: An electrochemical separation device includes a first electrode, a second electrode, a cell stack including alternating depleting compartments and concentrating compartments disposed between the first electrode and the second electrode, an inlet manifold configured to introduce a fluid to one of the depleting compartments or the concentrating compartments an outlet manifold, and one or more of a fluid flow director disposed within the inlet manifold and having a surface configured to alter a flow path of the fluid introduced into the inlet manifold and direct the fluid into the one of the depleting compartments or the concentrating compartments, and a second fluid flow director disposed within the outlet manifold and having a surface configured to alter a flow path of the fluid introduced into the outlet manifold via one of the depleting compartments or the concentrating compartments.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 29, 2023
    Applicant: Evoqua Water Technologies LLC
    Inventors: Joshua Griffis, Li-Shiang Liang, William Lane, Simon P. Dukes, Kris Wy Loon LIM
  • Patent number: 11511231
    Abstract: An electrochemical separation device includes a first electrode, a second electrode, a cell stack including alternating depleting compartments and concentrating compartments disposed between the first electrode and the second electrode, an inlet manifold configured to introduce a fluid to one of the depleting compartments or the concentrating compartments an outlet manifold, and one or more of a fluid flow director disposed within the inlet manifold and having a surface configured to alter a flow path of the fluid introduced into the inlet manifold and direct the fluid into the one of the depleting compartments or the concentrating compartments, and a second fluid flow director disposed within the outlet manifold and having a surface configured to alter a flow path of the fluid introduced into the outlet manifold via one of the depleting compartments or the concentrating compartments.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: November 29, 2022
    Assignee: Evoqua Water Technologies LLC
    Inventors: Joshua Griffis, Li-Shiang Liang, William Lane, Simon P. Dukes, Kris Wy Loon Lim
  • Publication number: 20210001276
    Abstract: An electrochemical separation device includes a first electrode, a second electrode, a cell stack including alternating depleting compartments and concentrating compartments disposed between the first electrode and the second electrode, an inlet manifold configured to introduce a fluid to one of the depleting compartments or the concentrating compartments an outlet manifold, and one or more of a fluid flow director disposed within the inlet manifold and having a surface configured to alter a flow path of the fluid introduced into the inlet manifold and direct the fluid into the one of the depleting compartments or the concentrating compartments, and a second fluid flow director disposed within the outlet manifold and having a surface configured to alter a flow path of the fluid introduced into the outlet manifold via one of the depleting compartments or the concentrating compartments.
    Type: Application
    Filed: June 20, 2018
    Publication date: January 7, 2021
    Applicant: Evoqua Water Technologies LLC
    Inventors: Joshua Griffis, Li-Shiang Liang, William Lane, Simon P. Dukes, Kris Wy Loon LIM
  • Patent number: 7427009
    Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: September 23, 2008
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Loon A Lim, Charles J Vath, III
  • Publication number: 20070262119
    Abstract: A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 15, 2007
    Inventors: Malliah Ramkumar, Loon Lim, Charles Vath, Christopher Carr, Robert Lyn, John Persic, Young-Kyu Song
  • Publication number: 20050284913
    Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.
    Type: Application
    Filed: June 24, 2004
    Publication date: December 29, 2005
    Inventors: Loon Lim, Charles Vath