Abstract: The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO.sub.2 coating, SiO.sub.2 /ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and heating the coated substrate at a temperature sufficient to convert the resins to ceramics.

Abstract: The present invention relates to a method of forming luminescent coatings on substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a phosphor filler on a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a ceramic coating.

Abstract: A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.

Abstract: Disclosed is a method of forming a coating on a substrate. The method involves coating the substrate with a resinous co-hydrolysate having units of the formula HSi(OH).sub.x (OR).sub.y O.sub.z/2 and Si(OH).sub.a (OR).sub.b O.sub.c/2 in a ratio of 1:3 or less followed by heating the coated substrate to a temperature of between about 50.degree. and about 1000.degree. C.

Abstract: A coating composition comprising hydrogen silsesquioxane resin and a phosphor filler diluted in a solvent. These compositions are used to form luminescent coatings on substrates.

Abstract: The present invention relates to a method of forming composite coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a refractory fiber on an electronic substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin into a ceramic.

Abstract: Disclosed is a method of forming a coating on a substrate. The method comprises applying a silane and, optionally, a titanium catalyst, onto the substrate and allowing the silane to hydrolyze and condense with atmospheric moisture to form an insoluble coating.

Abstract: Disclosed is a method of forming metal containing ceramic coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a metallic filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the metallic filler.

Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: A method of co-hydrolyzing silanes of the formulas HSi(OR).sub.3 and Si(OR).sub.4 to form a soluble resinous co-hydrolysate is disclosed. The method comprises hydrolyzing the silanes with water in an acidified oxygen containing polar organic solvent. The invention also relates to the soluble co-hydrolysates formed thereby as well as the method of using the co-hydrolysates to provide coatings on various substrates, including electronic devices.

Abstract: The present invention relates to the application of ceramic coatings on substrates. The method comprises applying a preceramic coating comprising hydrogen silsesquioxane resin, a material containing Si--Si bonds which forms volatile SiH compounds, and a catalyst followed by pyrolyzing the preceramic coating in an inert atmosphere. The novel ceramic coatings formed by the process of this invention are especially valuable on electronic devices.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a borosilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic coating.

Abstract: The present invention relates to a method of forming protective coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a polysilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the polysilazane to a ceramic.

Abstract: Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: Disclosed is a method of forming high dielectric constant coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a high dielectric constant filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the filler.

Abstract: The present invention relates to a method of forming a coating on a substrate in the absence of oxygen. The method comprises coating the substrate with a solution comprising a solvent and hydrogen silsesquioxane resin. The solvent is evaporated and a preceramic coating thereby deposited on the substrate. The preceramic coating is then heated to a temperature of between about 500.degree. up to about 1000.degree. C. under an inert gas atmosphere. The process of the invention is useful for forming protective coatings on any substrate prone to oxidation. The present invention also relates to the formation of additional coatings on the coating formed above.

Abstract: A silica coating is formed on an electronic substrate by applying a silazane polymer on the substrate and converting it to silica by heating in an oxidizing environment. The resultant thick planarizing coatings are useful as protective coatings and dielectric inner layers.

Abstract: Disclosed are compositions which are useful for forming photodelineable coatings on substrates. The compositions contain a solvent, hydrogen silsesquioxane resin and an initiator which generates free radicals upon exposure to radiation.

Abstract: A single or multilayer ceramic or ceramic-like coating process is provided which can be applied to heat sensitive substrates such as electronic devices. The process includes the steps of coating the substrate with a solution comprising a hydrogen silsesquioxane resin diluted in a solvent and then evaporating the solvent, thereby depositing a preceramic coating on the substrate. The preceramic coating is then ceramified to a silicon dioxide-containing ceramic by heating the preceramic coating to a temperature of between about 40.degree. to about 400.degree. C. in the presence of ozone which enhances the rate at which the ceramification proceeds and permits the ceramification of the coating to proceed at low temperatures. Additional layers of ceramic materials may be deposited over the initial layer and act as passivating and/or barrier protective layers.