Abstract: This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.

Abstract: A composition for preparing a pressure sensitive adhesive contains (A) a hydroxyl-functional polydiorganosiloxane polymer, (B) a hydroxyl-functional polyorganosiloxane resin, and (C) a solvent. A continuous method for producing the silicone pressure sensitive adhesive is performed by mixing the composition while heating the composition at a temperature above the vaporization point of the solvent and removing essentially all volatile species in an apparatus with a residence time sufficient for bodying ingredients (A) and (B). A devolatilizing twin-screw extruder is useful in the method.

Abstract: A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.

Abstract: This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.

Abstract: Organohydrogensilicon compounds containing at least one silicon-bonded hydrogen atom per molecule and at least one cyclosiloxane.

Abstract: A composition comprising (A) at least one compound having at least one aliphatic unsaturation; (B) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and (C) a platinum group metal-containing catalyst.

Abstract: The instant invention pertains to a hot-melt pressure sensitive adhesive composition wherein the composition is comprised of a silicone pressure sensitive adhesive selected from the group consisting of a mixture of (i) a silicone resin and (ii) a silicone fluid and a condensed product of (i) and (ii); the silicone pressure sensitive adhesive exhibiting tackiness and adhesiveness; the silicone pressure sensitive adhesive being blended with (iii) from about 1 to 20 weight percent, based on the total weight of (i) and (ii), of a siloxylated polyether wax. The instant invention also encompasses method of using the composition, methods of making hot-melt silicone pressure sensitive adhesive-coated substrates, and devices made using the composition.