Patents by Inventor Loren Durfee

Loren Durfee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060189767
    Abstract: This invention relates to silicone compositions suitable for forming pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.
    Type: Application
    Filed: March 16, 2004
    Publication date: August 24, 2006
    Applicant: DOW CORNING CORPORATION
    Inventors: Dorab Bhagwagar, Loren Durfee
  • Publication number: 20060116500
    Abstract: This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.
    Type: Application
    Filed: December 17, 2003
    Publication date: June 1, 2006
    Inventors: Brian Chapman, Loren Durfee, Timothy Mitchell, James Steven Tonge, Paul Vandort
  • Publication number: 20060111491
    Abstract: A composition comprising (A) at least one compound having at least one aliphatic unsaturation; (B) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and (C) a platinum group metal-containing catalyst.
    Type: Application
    Filed: April 29, 2003
    Publication date: May 25, 2006
    Inventors: Karmen Asch, Brian Chapman, Loren Durfee, Robert Hensel, Timothy Mitchell, James Tonge, Paul Van Dort, Loretta Jones
  • Publication number: 20060074212
    Abstract: A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.
    Type: Application
    Filed: December 17, 2003
    Publication date: April 6, 2006
    Applicant: Dow Corning Corporation
    Inventors: Brian Chapman, Loren Durfee, Timothy Mitchell, James Tonge, Paul Vandort
  • Publication number: 20050256286
    Abstract: Organohydrogensilicon compounds containing at least one silicon-bonded hydrogen atom per molecule and at least one cyclosiloxane.
    Type: Application
    Filed: April 29, 2003
    Publication date: November 17, 2005
    Inventors: Karmen Asch, Brian Chapman, Loren Durfee, Robert Hensel, Timothy Mitchell, James Tonge, Paul Van Dort
  • Patent number: 5352722
    Abstract: Hot-melt silicone pressure sensitive adhesive compositions containing alkylmethylsiloxane waxes and methods of using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an alkylmethylsiloxane wax having a melting point of between 30.degree. C. and 70.degree. C. The alkylmethylsiloxane wax decreases dynamic viscosity of the adhesive compositions at temperatures ranging from about 50.degree. C. to about 200.degree. C.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: October 4, 1994
    Assignee: Dow Corning Corporation
    Inventors: Randall P. Sweet, Loren Durfee, Katherine L. Ulman, Ross A. Noel