Patents by Inventor Loren R. Jacobs
Loren R. Jacobs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7655093Abstract: A wafer support system comprising a susceptor having top and bottom sections and gas flow passages therethrough. One or more spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: January 29, 2007Date of Patent: February 2, 2010Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 7186298Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: August 18, 2003Date of Patent: March 6, 2007Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Patent number: 7169234Abstract: A substrate support assembly positively secures a substrate holder support to a rotation shaft with respect to rotationally applied forces. A substrate holder support is configured to have an opening in a socket into which, when aligned with an indentation in the rotational shaft to form a passage, a retaining member is removably inserted to engage both the socket opening and the shaft indentation. Methods of rotating a substrate while minimizing rotational slippage of the substrate holder support with respect to the shaft are also provided.Type: GrantFiled: January 30, 2004Date of Patent: January 30, 2007Assignee: ASM America, Inc.Inventors: Thomas M. Weeks, Lewis C. Barnett, Loren R. Jacobs, Eric R. Wood, Michael W. Halpin
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Patent number: 6893507Abstract: Improvements in the design of a low mass wafer holder are disclosed. The improvements include the use of peripherally located, integral lips to space a wafer or other substrate above the base plate of the wafer holder. A uniform gap is thus provided between the wafer and the base plate, such as will temper rapid heat exchanges, allow gas to flow between the wafer and wafer holder during wafer pick-up, and keep the wafer holder thermally coupled with the wafer. At the same time, thermal disturbance from lip contact with the wafer is reduced. Gas flow during pick-up can be provided through radial channels in a wafer holder upper surface, or through backside gas passages. A thicker ring is provided at the wafer holder perimeter, and is provided in some embodiments as an independent piece to accommodate stresses accompanying thermal gradients. Self-centering mechanisms are provided to keep the wafer holder centered relative to a spider which is subject to differential thermal expansion.Type: GrantFiled: July 18, 2002Date of Patent: May 17, 2005Assignee: ASM America, Inc.Inventors: Matthew G. Goodman, Ivo Raaijmakers, Loren R. Jacobs, Franciscus B. M. van Bilsen, Michael J. Meyer, Eric Alan Barrett
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Publication number: 20040198153Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: August 18, 2003Publication date: October 7, 2004Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6692576Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: September 13, 2002Date of Patent: February 17, 2004Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Publication number: 20030075274Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: September 13, 2002Publication date: April 24, 2003Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Publication number: 20030029571Abstract: Improvements in the design of a low mass wafer holder are disclosed. The improvements include the use of peripherally located, integral lips to space a wafer or other substrate above the base plate of the wafer holder. A uniform gap is thus provided between the wafer and the base plate, such as will temper rapid heat exchanges, allow gas to flow between the wafer and wafer holder during wafer pick-up, and keep the wafer holder thermally coupled with the wafer. At the same time, thermal disturbance from lip contact with the wafer is reduced. Gas flow during pick-up can be provided through radial channels in a wafer holder upper surface, or through backside gas passages. A thicker ring is provided at the wafer holder perimeter, and is provided in some embodiments as an independent piece to accommodate stresses accompanying thermal gradients. Self-centering mechanisms are provided to keep the wafer holder centered relative to a spider which is subject to differential thermal expansion.Type: ApplicationFiled: July 18, 2002Publication date: February 13, 2003Inventors: Matthew G. Goodman, Ivo Raaijmakers, Loren R. Jacobs, Franciscus B.M. van Bilsen, Michael J. Meyer, Eric Alan Barrett
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Patent number: 6491757Abstract: An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. The controller is configured to vary the ratio during a high temperature processing cycle of a substrate to thereby vary the ratio of the heat provided by the heat sources during the cycle.Type: GrantFiled: August 17, 2001Date of Patent: December 10, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Publication number: 20020179586Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: ApplicationFiled: August 1, 2002Publication date: December 5, 2002Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins
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Patent number: 6464792Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: GrantFiled: July 11, 2000Date of Patent: October 15, 2002Assignee: ASM America, Inc.Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins
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Patent number: 6454866Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: July 10, 2000Date of Patent: September 24, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6454865Abstract: Improvements in the design of a low mass wafer holder are disclosed. The improvements include the use of peripherally located, integral lips to space a wafer or other substrate above the base plate of the wafer holder. A uniform gap is thus provided between the wafer and the base plate, such as will temper rapid heat exchanges, allow gas to flow between the wafer and wafer holder during wafer pick-up, and keep the wafer holder thermally coupled with the wafer. At the same time, thermal disturbance from lip contact with the wafer is reduced. Gas flow during pick-up can be provided through radial channels in a wafer holder upper surface, or through backside gas passages. A thicker ring is provided at the wafer holder perimeter, and is provided in some embodiments as an independent piece to accommodate stresses accompanying thermal gradients. Self-centering mechanisms are provided to keep the wafer holder centered relative to a spider which is subject to differential thermal expansion.Type: GrantFiled: October 17, 2001Date of Patent: September 24, 2002Assignee: ASM America, Inc.Inventors: Matthew G. Goodman, Ivo Raaijmakers, Loren R. Jacobs, Franciscus B. M. van Bilsen, Michael J. Meyer, Eric Alan Barrett
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Publication number: 20020043337Abstract: Improvements in the design of a low mass wafer holder are disclosed. The improvements include the use of peripherally located, integral lips to space a wafer or other substrate above the base plate of the wafer holder. A uniform gap is thus provided between the wafer and the base plate, such as will temper rapid heat exchanges, allow gas to flow between the wafer and wafer holder during wafer pick-up, and keep the wafer holder thermally coupled with the wafer. At the same time, thermal disturbance from lip contact with the wafer is reduced. Gas flow during pick-up can be provided through radial channels in a wafer holder upper surface, or through backside gas passages. A thicker ring is provided at the wafer holder perimeter, and is provided in some embodiments as an independent piece to accommodate stresses accompanying thermal gradients. Self-centering mechanisms are provided to keep the wafer holder centered relative to a spider which is subject to differential thermal expansion.Type: ApplicationFiled: October 17, 2001Publication date: April 18, 2002Inventors: Matthew G. Goodman, Ivo Raaijmakers, Loren R. Jacobs, Franciscus B. M. van Bilsen, Michael J. Meyer, Eric Alan Barrett
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Patent number: 6343183Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: June 27, 2000Date of Patent: January 29, 2002Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Publication number: 20010054390Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: ApplicationFiled: August 17, 2001Publication date: December 27, 2001Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6293749Abstract: A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the outer susceptor sections. When the inner section is engaged, the support spider lifts the inner section vertically out of the outer section. When the outer section is engaged, the support spider raises and lowers the entire susceptor unit. A robotic arm end effector engaging only the lower surface of the outer edge of the wafer permits hot wafer pick-up and unloading by the inner susceptor section. Several end effectors are disclosed that minimize non-uniform thermal effect on the substrate.Type: GrantFiled: November 17, 1998Date of Patent: September 25, 2001Assignee: ASM America, Inc.Inventors: Ivo Raaijmakers, Loren R. Jacobs, Michael W. Halpin, James A. Alexander, Ken O'Neill, Dennis L. Goodwin
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Patent number: 6203622Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support wafers in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The susceptor support arms are hollow and conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages within the segmented susceptor are arranged to provide even heat distribution from the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: January 11, 2000Date of Patent: March 20, 2001Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs
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Patent number: 6113702Abstract: A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.Type: GrantFiled: September 4, 1997Date of Patent: September 5, 2000Assignee: ASM America, Inc.Inventors: Michael W. Halpin, Mark R. Hawkins, Derrick W. Foster, Robert M. Vyne, John F. Wengert, Cornelius A. van der Jeugd, Loren R. Jacobs, Frank B. M. Van Bilsen, Matthew Goodman, Hartmann Glenn, Jason M. Layton
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Patent number: 6093252Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate.Type: GrantFiled: April 25, 1996Date of Patent: July 25, 2000Assignee: ASM America, Inc.Inventors: John F. Wengert, Loren R. Jacobs, Michael W. Halpin, Derrick W. Foster, Cornelius A. van der Jeugd, Robert M. Vyne, Mark R. Hawkins