Abstract: A coupler that has a small package size and is adjustable after manufacturing. A coupler has a substrate with several dielectric layers and a top and bottom surface. A ground plane is located on the top surface and another ground plane is located on the bottom surface. A pair of coupled circuit lines are located within the substrate. Conductive vias extend between the layers and provide an electrical connection between the ground planes and the circuit lines. The top ground plane has several segments joined by links. The top ground plane can be modified to adjust the coupling between the coupled circuit lines by deleting one or more of the links. The links can be used to adjust the coupling after the coupler has been manufactured.

Abstract: A coupler that has a small package size and is adjustable after manufacturing. A coupler has a substrate with several dielectric layers and a top and bottom surface. A ground plane is located on the top surface and another ground plane is located on the bottom surface. A pair of coupled circuit lines are located within the substrate. Conductive vias extend between the layers and provide an electrical connection between the ground planes and the circuit lines. The top ground plane has several segments joined by links. The top ground plane can be modified to adjust the coupling between the coupled circuit lines by deleting one or more of the links. The links can be used to adjust the coupling after the coupler has been manufactured.

Abstract: A power splitter that has a small package size and low cross-talk noise. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as transmission lines and resistors are integrated onto and within the LTCC substrate. The power splitter provides impedance matching and dividing functions. The LTCC substrate has counter rotating spiral shaped circuit lines and electrically conductive vias extending therethrough. The vias are used to connect the power splitter to an external printed circuit board. The vias are also used to make electrical connections between the layers of the LTCC substrate. The counter rotating circuit lines allow the power splitter to have a small package size and low cross-talk noise.

Abstract: A power splitter that has a small package size and low cross-talk noise. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as transmission lines and resistors are integrated onto and within the LTCC substrate. The power splitter provides impedance matching and dividing functions. The LTCC substrate has counter rotating spiral shaped circuit lines and electrically conductive vias extending therethrough. The vias are used to connect the power splitter to an external printed circuit board. The vias are also used to make electrical connections between the layers of the LTCC substrate. The counter rotating circuit lines allow the power splitter to have a small package size and low cross-talk noise.