Abstract: A magnetic disk substrate polishing assembly used for polishing a surface of a disk substrate as the disk substrate is rotated, the polishing assembly comprising a polish roller having a polish cloth or polish tape continuously fed thereon. The polish roller is rotatably mounted on an assembly housing with the polish roller disposed adjacent the rotating disk blank. The polish roller is moved toward and pressed against the surface of the disk substrate with the polish tape therebetween. The polish roller is spring biased in a direction toward and perpendicular to the surface of the disk substrate which allows the roller with polish tape thereon to conform to the surface of the disk substrate so as to reduce ripples and make a uniform pattern on the polished surface of the disk substrate when the polishing operation is completed.