Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

Abstract: The problem confronting manufacturers of printed circuit boards (2) of differing thickness is that, as the current density increases and the diameter of the holes decreases, the treatment effect on various locations on the outer side of the boards and inside the holes becomes more irregular. To resolve this problem, a conveyorized horizontal processing line and a method of wet-processing printed circuit boards (2) is described.

Abstract: A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally contains compounds of an electrochemically reversible redox system. With the oxidized form of said system, metal is dissolved in an ion generator 1, traversed by the fluid, so that these compounds are thereby reduced. For the deposition of metal, the dissolved metal ions on the item to be treated are reduced. The compounds of the redox system in the reduced form are oxidized again on the insoluble anodes in the electroplating system 13. In order to keep the concentration of the metal ions in the electrolytic fluid constant, at least a portion of the electrolytic fluid, contained in the electroplating system, is conducted through one or a plurality of electrolytic auxiliary cells 6.

Abstract: The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to be treated, guided in a horizontal plane of conveyance in a continuous electroplating plant. The device has counter-electrodes 2, 3 located opposite the plane of conveyance and clamps 4, secured to a continuously revolving means of conveyance 5, for contacting the items to be treated 7. The clamps 4 have a lower portion 14 and an upper portion 13 which are electrically conductive, have a surface consisting of metal, are moveable in relation to one another and respectively have at least one contact point 6 for the items to be treated 7. In addition, at least one current source is provided to produce a flow of current between the counter-electrodes and the items to be treated.

Abstract: The apparatus for electrolytically treating printed circuit boards 3, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: Counter-electrodes 1,2 are disposed opposite the plane of conveyance and substantially parallel thereto on at least one side, so that electrolytic chambers 4,5 are formed between counter-electrodes, which are situated opposite one another, or between the counter-electrodes and the plane of conveyance, the counter-electrodes forming respective substantially continuous electrode faces. Guide elements 7,8 for the printed circuit boards are disposed in the electrolytic chamber. Contact elements 11 are provided for the electrical contacting of the printed circuit boards. Electrolyte spraying arrangements 13 are also provided for conveying the electrolytic fluid towards the surfaces of the printed circuit boards. Openings are provided in the counter-electrodes.

Abstract: The apparatus according to the invention is used for electrolytically treating a board-shaped substrate to be treated, preferably printed circuit boards, in a continuous system, through which the item to be treated is guidable in a plane of conveyance in a substantially horizontal direction of conveyance, the apparatus having counter-electrodes (2), which are situated substantially parallel to one another opposite the plane of conveyance, and screens (11) for shielding from high current density fields in the edge region of the item to be treated (1), said screens being disposed between the plane of conveyance and the counter-electrodes, the screens each being in the form of at least two flat portions (12,13), which are disposed substantially parallel to each other, one portion (13) of the screens being disposed so as to lie opposite the plane of conveyance, and the other portion (12) being disposed so as to lie opposite the counter-electrodes, and the screens being mounted so as to be displaceable in a direct

Abstract: The invention relates to a method for maintaining constant concentrations of substances contained in an electrolytic treatment bath, preferably in baths with aqueous solutions. In order to regenerate the continual depletion of chemicals, substance concentrates are added to the baths according to known methods. The rapid increase in concentrations of damaging substances in the processing solution is disadvantageous. In order to reduce this build-up, a further metering method is known, namely the continuous replacement of bath solution by creating a bath overflow. The addition of bath solution with the bath concentration is balanced out by the overflow. As a consequence of evaporation and entrainment this method also leads to the fact that the operating concentration cannot be maintained for a long period of time in chemically critical baths.

Abstract: The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long.

Abstract: The invention relates to a method and device for electroplating plate-shaped product, particularly printed circuit boards, in horizontal continuous plants with optional sequence of product, revolving contacting means serving for electrical connection of a source of bath current via wiper rails with the product, and the beginning and end of each individual product item at the inlet to the electroplating plant, and the transport speed of the product, being detected with the aid of sensors, said sensors sending sensor signals to a control system which ascertains whether a product item is present at the gripping point of the contacting means or not, the contacting means being connected electrically and in the electroplating sense in a low-resistance manner to the sources of bath current only when product is present in the region of contacts of the contacting means.

Abstract: An arrangement for galvanization of treatment goods, such as for example electronic printed circuits, comprises a plurality of successively arranged baths accommodated in bath container units having open sides, covers for selectively covering the upper sides of the container units, units for aspirating vapors located in the bath containers above a liquid level of a bath liquid, units for introducing and withdrawing treatment goods into and out of the bath. The aspirating units include air aspiration inlets located at such a distance under an upper edge of the container units that whirling of an aspirated air is substantially eliminated and a substantial part of the vapors in a space above the liquid level is entrained by the aspirated air. The aspirating inlets are arranged above a maximum bath height, and the cover being arranged at such a height and being dimensioned relative to the container units so that an air passage is produced between the cover and the container unit.