Abstract: An implantable catheter is provided that may be disinfected without removal from the body of a patient, using a photocatalytic method to activate a reaction on the catheter surface that generates oxidizing agents in the form of Reactive Oxygen Species (“ROS”) and thus destroy microorganisms in a biofilm that is present or forming. A catheter system includes the implantable catheter, a light source, and a source of power operably connected to the light source. Methods are also provided for disinfecting the implantable catheter in vivo.

Abstract: In one embodiment, the present disclosure relates generally to a method for thermally decomposing a complex precursor salt. In one embodiment, the method includes heating a salt in a reactor until a molten salt is formed, adding the complex precursor salt to the molten salt in the reactor and removing a volatile precursor halide formed from thermal decomposition of the complex precursor salt from the reactor.

Abstract: In one embodiment, the present disclosure relates generally to a method for recovering an element from a mixture of the element with an ionic halide. In one embodiment, the method includes treating the mixture of the element and the ionic halide with an acidic solution to dissolve the ionic halide, wherein the acidic solution comprises water and an acid and has a pH of less than 1.0 and removing the element from an aqueous solution that results after the treating step.

Abstract: A barrier film composite includes a film with an undulating surface; and at least one decoupling layer and at least one barrier layer disposed on the undulating surface of the film.

Abstract: A barrier film composite includes a heat-shrinkable layer having a conformable surface conforming to a surface shape of an object in contact with the heat-shrinkable layer, and a flat surface disposed opposite to the conformable surface; and a barrier layer having a smaller thickness than the heat-shrinkable layer and disposed flat on the flat surface of the heat-shrinkable layer.

Abstract: A barrier film composite includes a decoupling layer and a barrier layer. The barrier layer includes a first region and a second region that is thinner than the first region.

Abstract: In one embodiment, the present invention relates generally to a multi-stage system for performing melt coalescence and separation, the multi-stage system. In one embodiment, the multi-stage system includes a first container for mixing a powder with a salt, the first container having an opening, a heating means coupled to the first container for heating the first container and a second container coupled to the first container.

Abstract: In one embodiment, the present invention relates generally to a method for reutilizing ionic halides in a production of an elemental material. In one embodiment, the method includes reacting a mixture of an ionic halide, at least one of: an oxide, suboxide or an oxyhalide of an element to be produced and an aqueous acid solution at moderate temperature to form a complex precursor salt and a salt, forming a precursor halide from the complex precursor salt, reducing the precursor halide into the element to be produced and the ionic halide and returning the ionic halide into the mixture of the reacting step.

Abstract: A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C?C bonds. An encapsulated environmentally sensitive device is also described.

Abstract: Methods of making an integrated barrier stack and optical enhancement layer for protecting and improving the light out coupling of encapsulated white OLEDs are described. The method includes optimizing the thickness of various layers including one or more of the plasma protective layer, the initial organic layer, the initial inorganic barrier layer, and the inorganic barrier layer and polymeric decoupling layer for the barrier stack. The thickness is optimized for at least one of total efficiency, or intentional color point shift so that the encapsulated OLED has enhanced light outcoupling compared to the bare OLED.

Abstract: Methods of making an integrated barrier stack and optical enhancement layer for protecting and improving the light out coupling of an encapsulated OLED are described. The method includes optimizing the thickness of various layers including the initial inorganic barrier layer and the inorganic barrier layer and polymeric decoupling layer for the barrier stack. The thickness is optimized for at least one of maximum efficiency, minimum dispersion, or minimum spectral shift so that the encapsulated OLED has enhanced light outcoupling compared to the bare OLED.

Abstract: The present invention relates generally to a liquid injector for silicon production. In one embodiment, the injector includes a tube having at least one opening at a first end of said tube, a moveable sealing means disposed inside the tube for sealing the at least one opening and a heating means coupled to the tube for controlling a temperature of a liquid exiting the tube through the at least one opening.

Abstract: An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.

Abstract: A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

Abstract: An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.

Abstract: A three dimensional multilayer barrier. The barrier includes a first barrier continuous layer adjacent to a substrate; a first discontinuous decoupling layer adjacent to the first continuous barrier layer, the first discontinuous decoupling layer having at least two sections; and a second continuous barrier layer adjacent to the first discontinuous decoupling layer, the second barrier forming a wall separating the sections of the first discontinuous decoupling layer. A method of making the three dimensional multilayer barrier is also described.

Abstract: A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C?C bonds. An encapsulated environmentally sensitive device is also described.

Abstract: A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

Abstract: The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I. The present composition is useful in semiconductor devices and may be advantageously used as an etch stop.

Abstract: The present invention provides an organosiloxane comprising at least 80 weight percent of Formula 1: [Y0.01-1.0SiO1.5-2]a{Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c (where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula 1; b is from 2 percent to 50 percent of Formula 1; and c is from 20 percent to 80 percent of Formula 1. The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.