Patents by Inventor Lorenzo Corso
Lorenzo Corso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240140783Abstract: A device and method for manufacturing a device comprising two semiconductor dice. The device is formed by a first die and a second die. The first die is of semiconductor material and integrates electronic components. The second die has a main surface, forms patterned structures, and is bonded to the first die. Internal electrical coupling structures electrically couple the main surface of the first die to the second die. External connection regions extend on the main surface of the first die. A package packages the first die, the second die and the internal electrical coupling structures and partially surrounds the external connection regions, the external connection regions partially protruding from the package.Type: ApplicationFiled: October 18, 2023Publication date: May 2, 2024Applicant: STMICROELECTRONICS S.r.l.Inventors: Mark Andrew SHAW, Lorenzo CORSO, Matteo GARAVAGLIA, Giorgio ALLEGATO
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Patent number: 11971284Abstract: Embodiments of a Coriolis-force-based flow sensing device and embodiments of methods for manufacturing embodiments of the Coriolis-force-based flow sensing device, comprising the steps of: forming a driving electrode; forming, on the driving electrode, a first sacrificial region; forming, on the first sacrificial region, a first structural portion with a second sacrificial region buried therein; forming openings for selectively etching the second sacrificial region; forming, within the openings, a porous layer having pores; removing the second sacrificial region through the pores of the porous layer, forming a buried channel; growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body; selectively removing the first sacrificial region thus suspending the structural body on the driving electrode.Type: GrantFiled: March 17, 2021Date of Patent: April 30, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Gabriele Gattere, Francesco Rizzini, Luca Guerinoni, Lorenzo Corso, Domenico Giusti
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Patent number: 11945712Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.Type: GrantFiled: May 14, 2021Date of Patent: April 2, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Giorgio Allegato, Lorenzo Corso, Ilaria Gelmi, Carlo Valzasina
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Patent number: 11920272Abstract: A laundry appliance having: a treatment chamber; and a humidity measuring arrangement for measuring the humidity of at least one item to be treated. The humidity measuring arrangement has a sensing capacitor and a capacitance sensing unit for measuring a capacitance of the sensing capacitor and obtaining an indication of the humidity of the item to be treated according to the measured capacitance. The sensing capacitor has first and second electrical conductors and a dielectric. A volume of the chamber forms part of the dielectric. The appliance has an extension member configured to be positioned within the chamber for extending the first electrical conductor within the laundry treatment chamber. The extension member has an extension conductor and a coupling conductor, and the extension conductor can be electrically coupled to the first electrical conductor through a capacitive coupling via the coupling electrical conductor.Type: GrantFiled: March 7, 2018Date of Patent: March 5, 2024Assignee: Electrolux Appliances AktiebolagInventors: Federico Del Maschio, Giorgio Pattarello, Lorenzo Corso
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Patent number: 11855604Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.Type: GrantFiled: September 24, 2020Date of Patent: December 26, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Federico Vercesi, Lorenzo Corso, Giorgio Allegato, Gabriele Gattere
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Patent number: 11691870Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.Type: GrantFiled: February 1, 2021Date of Patent: July 4, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Alessandro Tocchio, Lorenzo Corso
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Patent number: 11667519Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.Type: GrantFiled: February 1, 2021Date of Patent: June 6, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Alessandro Tocchio, Lorenzo Corso
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Publication number: 20230061430Abstract: Method for manufacturing a micro-electro-mechanical system, MEMS, integrating a first MEMS device and a second MEMS device. The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.Type: ApplicationFiled: August 26, 2022Publication date: March 2, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Paolo FERRARI, Lorenzo CORSO, Flavio Francesco VILLA, Silvia NICOLI, Luca LAMAGNA
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Publication number: 20220380203Abstract: A process for manufacturing a combined microelectromechanical device includes forming, in a die of semiconductor material, at least a first and a second microelectromechanical structure, performing a first bonding phase to bond a cap to the die via a bonding region or adhesive to define at least a first and a second cavity at the first and, respectively, second microelectromechanical structures, the cavities being at a controlled pressure, forming an access channel through the cap in fluidic communication with the first cavity to control the pressure value inside the first cavity in a distinct manner with respect to a respective pressure value inside the second cavity, and performing a second bonding phase, after which the bonding region deforms to hermetically close the first cavity with respect to the access channel.Type: ApplicationFiled: May 13, 2022Publication date: December 1, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Federico VERCESI, Luca SEGHIZZI, Laura OGGIONI, Lorenzo CORSO
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Patent number: 11274036Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: GrantFiled: March 11, 2020Date of Patent: March 15, 2022Assignee: STMicroelectronics S.r.l.Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
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Patent number: 11277112Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.Type: GrantFiled: August 12, 2020Date of Patent: March 15, 2022Assignee: STMICROELECTRONICS S.R.L.Inventors: Gabriele Gattere, Lorenzo Corso, Alessandro Tocchio, Carlo Valzasina
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Publication number: 20210363000Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.Type: ApplicationFiled: May 14, 2021Publication date: November 25, 2021Applicant: STMicroelectronics S.r.l.Inventors: Giorgio ALLEGATO, Lorenzo CORSO, Ilaria GELMI, Carlo VALZASINA
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Publication number: 20210293597Abstract: Embodiments of a Coriolis-force-based flow sensing device and embodiments of methods for manufacturing embodiments of the Coriolis-force-based flow sensing device, comprising the steps of: forming a driving electrode; forming, on the driving electrode, a first sacrificial region; forming, on the first sacrificial region, a first structural portion with a second sacrificial region buried therein; forming openings for selectively etching the second sacrificial region; forming, within the openings, a porous layer having pores; removing the second sacrificial region through the pores of the porous layer, forming a buried channel; growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body; selectively removing the first sacrificial region thus suspending the structural body on the driving electrode.Type: ApplicationFiled: March 17, 2021Publication date: September 23, 2021Applicant: STMICROELECTRONICS S.r.l.Inventors: Gabriele GATTERE, Francesco RIZZINI, Luca GUERINONI, Lorenzo CORSO, Domenico GIUSTI
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Publication number: 20210155472Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Inventors: Alessandro TOCCHIO, Lorenzo CORSO
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Publication number: 20210099154Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.Type: ApplicationFiled: September 24, 2020Publication date: April 1, 2021Inventors: Federico VERCESI, Lorenzo CORSO, Giorgio ALLEGATO, Gabriele GATTERE
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Patent number: 10934158Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.Type: GrantFiled: January 4, 2019Date of Patent: March 2, 2021Assignee: STMICROELECTRONICS S.r.l.Inventors: Alessandro Tocchio, Lorenzo Corso
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Publication number: 20210040676Abstract: A laundry appliance having: a treatment chamber; and a humidity measuring arrangement for measuring the humidity of at least one item to be treated. The humidity measuring arrangement has a sensing capacitor and a capacitance sensing unit for measuring a capacitance of the sensing capacitor and obtaining an indication of the humidity of the item to be treated according to the measured capacitance. The sensing capacitor has first and second electrical conductors and a dielectric. A volume of the chamber forms part of the dielectric. The appliance has an extension member configured to be positioned within the chamber for extending the first electrical conductor within the laundry treatment chamber. The extension member has an extension conductor and a coupling conductor, and the extension conductor can be electrically coupled to the first electrical conductor through a capacitive coupling via the coupling electrical conductor.Type: ApplicationFiled: March 7, 2018Publication date: February 11, 2021Applicant: Electrolux Appliances AktiebolagInventors: Federico Del Maschio, Giorgio Pattarello, Lorenzo Corso
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Publication number: 20200385260Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: ApplicationFiled: March 11, 2020Publication date: December 10, 2020Inventors: Giorgio ALLEGATO, Barbara SIMONI, Carlo VALZASINA, Lorenzo CORSO
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Publication number: 20200373904Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Gabriele Gattere, Lorenzo Corso, Alessandro Tocchio, Carlo Valzasina
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Patent number: 10771042Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.Type: GrantFiled: May 10, 2018Date of Patent: September 8, 2020Assignee: STMicroeletronics S.r.l.Inventors: Gabriele Gattere, Lorenzo Corso, Alessandro Tocchio, Carlo Valzasina