Patents by Inventor Loreta TAMASAUSKAITE-TAMASIUNAITE

Loreta TAMASAUSKAITE-TAMASIUNAITE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless deposition of continuous platinum layer using complexed Co metal ion reducing agent
    Patent number: 9499913
    Abstract: A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: November 22, 2016
    Assignee: Lam Research Corporation
    Inventors: Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Loreta Tamasauskaite-Tamasiunaite, Aniruddha Joi, Yezdi Dordi
  • Electroless deposition of continuous platinum layer
    Patent number: 9469902
    Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: October 18, 2016
    Assignee: Lam Research Corporation
    Inventors: Eugenijus Norkus, Aldona Jagminiene, Albina Zieliene, Ina Stankeviciene, Loreta Tamasauskaite-Tamasiunaite, Aniruddha Joi, Yezdi Dordi
  • Electroless deposition of continuous cobalt layer using complexed Timetal ions as reducing agents
    Patent number: 9428836
    Abstract: A solution for electroless deposition of cobalt is provided. A reducing agent of Ti3+ ions is provided to the solution. Co2+ ions are provided to the solution.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: August 30, 2016
    Assignee: Lam Research Corporation
    Inventors: Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Aniruddha Joi, Loreta Tamasauskaite-Tamasiunaite, Yezdi Dordi, Zita Sukackiene
  • ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
    Publication number: 20150307994
    Abstract: A solution for electroless deposition of nickel is provided. A reducing agent of Ti3+ ion is provided to the solution. Ni2+ ions are provided to the solution.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 29, 2015
    Applicant: Lam Research Corporation
    Inventors: Eugenijus NORKUS, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Aldona JAGMINIENE, Ina STANKEVICIENE, Yezdi DORDI
  • ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
    Publication number: 20150307993
    Abstract: A solution for electroless deposition of cobalt is provided. A reducing agent of Ti3+ ions is provided to the solution. Co2+ ions are provided to the solution.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 29, 2015
    Applicant: Lam Research Corporation
    Inventors: Eugenijus NORKUS, Ina STANKEVICIENE, Aldona JAGMINIENE, Aniruddha JOI, Loreta TAMASAUSKAITE-TAMASIUNAITE, Yezdi DORDI, Zita SUKACKIENE
  • ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED Co2+ METAL ION REDUCING AGENT
    Publication number: 20150284857
    Abstract: A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 8, 2015
    Applicant: Lam Research Corporation
    Inventors: Eugenijus NORKUS, Ina STANKEVICIENE, Aldona JAGMINIENE, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Yezdi DORDI
  • ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER
    Publication number: 20150232995
    Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 20, 2015
    Applicant: Lam Research Corporation
    Inventors: Eugenijus NORKUS, Aldona JAGMINIENE, Albina ZIELIENE, Ina STANKEVICIENE, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Yezdi DORDI