Patents by Inventor Loreto Ycong Cantillep

Loreto Ycong Cantillep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6834658
    Abstract: An apparatus is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning apparatus uses a dummy BGA substrate as part of and during the cleaning procedure. This dummy BGA substrate replaces the conventionally used copper strips that shield areas of the molding tools during the cleaning cycle. The dummy copper strips require, during and as part of the melamine cleaning process, frequent cleaning, which adds considerably to the time and expense of the melamine cleaning process.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: December 28, 2004
    Assignee: St Assembly Test Services PTE Ltd.
    Inventor: Loreto Ycong Cantillep
  • Publication number: 20030024548
    Abstract: A new method is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning process applies a dummy BGA substrate as part of and during the cleaning procedure. This dummy BGA substrate replaces the conventionally used copper strips that shield areas of the molding tools during the cleaning cycle. The dummy copper strips require, during and as part of the melamine cleaning process, frequent cleaning, which adds considerable to the time and expense of the melamine cleaning process.
    Type: Application
    Filed: September 6, 2002
    Publication date: February 6, 2003
    Applicant: ST ASSEMBLY TEST SERVICES PTE LTD
    Inventor: Loreto Ycong Cantillep
  • Patent number: 6468361
    Abstract: A new method is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning process applies a dummy BGA substrate as part of and during the cleaning procedure. This dummy BGA substrate replaces the conventionally used copper strips that shield areas of the molding tools during the cleaning cycle. The dummy copper strips require, during and as part of the melamine cleaning process, frequent cleaning, which adds considerable to the time and expense of the melamine cleaning process.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: October 22, 2002
    Assignee: ST Assembly Test Service Ltd.
    Inventor: Loreto Ycong Cantillep