Abstract: Liquid organosiloxane compositions that cure by a hydrosilylation reaction and contain from 0.1 to about 2 weight percent of a low molecular weight polymethylvinylsiloxane cure to form adhesives that are sufficiently flexible to retain cohesive bonding between substrates exhibiting different coefficients of thermal expansion when the resulting composite is exposed to variations in temperatures during use. The flexibility of the cured adhesive is further increased by addition to the curable compositions of a liquid polydimethylsiloxane having a silanol group at one of the two terminal positions and a triorganosiloxy group at the second terminal position. Preferred compositions are packaged in at least two parts, with the organohydrogensiloxane and the hydrosilylation catalyst being located in different parts of said composition.

Abstract: An improved electrically conductive polydiorganosiloxane of the type comprising a polydiorganosiloxane and conductive carbon particles has been developed. The improved electrical conductivity results from the addition of a conductivity improver comprising disilazane of the formula (R.sub.3 Si).sub.2 NH where R is a substituted or unsubstituted alkyl radical of from 1 to 6 carbon atoms or hydroxyl endblocked polymethylphenylsiloxane.

Abstract: An improved electrically conductive polydiorganosiloxane of the type comprising a polydiorganosiloxane and conductive carbon particles has been developed. The improved electrical conductivity results from the addition of a conductivity improver comprising disilazane of the formula (R.sub.3 Si).sub.2 NH where R is a substituted or unsubstituted alkyl radical of from 1 to 6 carbon atoms or hydroxyl endblocked polymethylphenylsiloxane.