Patents by Inventor Lori A. Dunaway

Lori A. Dunaway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7314777
    Abstract: An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: January 1, 2008
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Patent number: 7297573
    Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: November 20, 2007
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Patent number: 7074636
    Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: July 11, 2006
    Assignee: Honeywell International Inc.
    Inventors: Harlan L. Curtis, Max C. Glenn, Jon B. DCamp, Lori A. Dunaway
  • Patent number: 7037805
    Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: May 2, 2006
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Patent number: 6987304
    Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: January 17, 2006
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Patent number: 6927098
    Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: August 9, 2005
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Patent number: 6914323
    Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: July 5, 2005
    Assignee: Honeywell International Inc.
    Inventors: Harlan L. Curtis, Max C. Glenn, Jon B. DCamp, Lori A. Dunaway
  • Publication number: 20040232455
    Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.
    Type: Application
    Filed: June 28, 2004
    Publication date: November 25, 2004
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Publication number: 20040223373
    Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 11, 2004
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Publication number: 20040222468
    Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 11, 2004
    Inventors: Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
  • Publication number: 20040183177
    Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.
    Type: Application
    Filed: March 20, 2003
    Publication date: September 23, 2004
    Inventors: Harlan L. Curtis, Max C. Glenn, Jon B. DCamp, Lori A. Dunaway