Patents by Inventor Lori A. Treseder

Lori A. Treseder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduced tolerance interconnect system
    Patent number: 5313369
    Abstract: A simple, low cost, reduced tolerance interconnect enclosure in which a blind m A siVpV:interconnect between modules and the backplane may be guaranteed without the need for assembly fixtures or floating connectors, and a method of manufacturing the enclosure. The enclosure includes two matching enclosure sections for holding a backplane. The backplane has spaced apart recesses on opposing edges. Each enclosure section includes alignment protrusions spaced apart to engage the backplane recesses. These protrusions have curved apex regions and a height greater than the depth of the backplane recesses. Means for latching the enclosure sections together are provided, and the enclosure sections are dimensioned such that when the enclosure sections are closed around the backplane, the protrusions from the enclosure sections are urged against the recesses on the backplane.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: May 17, 1994
    Assignee: Digital Equipment Corporation
    Inventors: Mark S. Lewis, Lori A. Treseder, Reuben Martinez, Ralph M. Tusler
  • Modular enclosure for electronic equipment
    Patent number: D353800
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: December 27, 1994
    Assignee: Digital Equipment Corp.
    Inventors: Mark S. Lewis, Lori A. Treseder, Ralph M. Tusler, Greg Suzda