Patents by Inventor Lori D. Carroll Shearer

Lori D. Carroll Shearer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder compositions for attaching a die to a substrate
    Patent number: 6740544
    Abstract: A method for attaching a die (11) to a substrate (15) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition (21) having a maximum melting temperature Tm1, of less than about 100 C. The liquid solder composition is contacted with a freezing agent (17 or 19) such that a second composition is formed which has a maximum melting temperature Tm2, wherein T2−Tm1 is at least about 25° C.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: May 25, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Floyd Strouse, Lori D. Carroll Shearer, Brant Besser
  • Solder compositions for attaching a die to a substrate
    Publication number: 20030215981
    Abstract: A method for attaching a die (11) to a substrate (15) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition (21) having a maximum melting temperature Tm1, of less than about 100 C. The liquid solder composition is contacted with a freezing agent (17 or 19) such that a second composition is formed which has a maximum melting temperature Tm2, wherein T2−Tm1 is at least about 25° C.
    Type: Application
    Filed: May 14, 2002
    Publication date: November 20, 2003
    Applicant: Motorola Inc.
    Inventors: Floyd Strouse, Lori D. Carroll Shearer, Brant Besser