Patents by Inventor Lori R. Borger

Lori R. Borger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9189439
    Abstract: In one embodiment, the present invention includes a system-on-a-chip (SoC) with first and second cores, interface logic coupled to the cores, chipset logic coupled to the interface logic, and a virtual firewall logic coupled between the chipset logic and the second core. The interface logic may include a firewall logic, a bus logic, and a test logic, and the chipset logic may include a memory controller to provide for communication with a memory coupled to the SoC. In some system implementations, both during test operations and functional operations, the second core can be disabled during normal operation to provide for a single core SoC, enabling greater flexibility of use of the SoC in many different implementations. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: November 17, 2015
    Assignee: Intel Corporation
    Inventors: Ramana Rachakonda, Lance E. Hacking, Mahesh K. Reddy, Lori R. Borger, Chee Hak Teh, Pawitter P. Bhatia, John P. Lee
  • Patent number: 8799728
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: August 5, 2014
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20140108695
    Abstract: In one embodiment, the present invention includes a system-on-a-chip (SoC) with first and second cores, interface logic coupled to the cores, chipset logic coupled to the interface logic, and a virtual firewall logic coupled between the chipset logic and the second core. The interface logic may include a firewall logic, a bus logic, and a test logic, and the chipset logic may include a memory controller to provide for communication with a memory coupled to the SoC. In some system implementations, both during test operations and functional operations, the second core can be disabled during normal operation to provide for a single core SoC, enabling greater flexibility of use of the SoC in many different implementations. Other embodiments are described and claimed.
    Type: Application
    Filed: December 27, 2013
    Publication date: April 17, 2014
    Inventors: Ramana Rachakonda, Lance E. Hacking, Mahesh K. Reddy, Lori R. Borger, Chee Hak Teh, Pawitter P. Bhatia, John P. Lee
  • Publication number: 20140053026
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: October 25, 2013
    Publication date: February 20, 2014
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8650629
    Abstract: In one embodiment, the present invention includes a system-on-a-chip (SoC) with first and second cores, interface logic coupled to the cores, chipset logic coupled to the interface logic, and a virtual firewall logic coupled between the chipset logic and the second core. The interface logic may include a firewall logic, a bus logic, and a test logic, and the chipset logic may include a memory controller to provide for communication with a memory coupled to the SoC. In some system implementations, both during test operations and functional operations, the second core can be disabled during normal operation to provide for a single core SoC, enabling greater flexibility of use of the SoC in many different implementations. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: February 11, 2014
    Assignee: Intel Corporation
    Inventors: Ramana Rachakonda, Lance E. Hacking, Mahesh K. Reddy, Lori R. Borger, Chee Hak Teh, Pawitter P. Bhatia, John P. Lee
  • Patent number: 8589745
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: November 19, 2013
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8543776
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: September 24, 2013
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20130103987
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: December 11, 2012
    Publication date: April 25, 2013
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20130054931
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: October 31, 2012
    Publication date: February 28, 2013
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8327198
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: December 4, 2012
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20110145909
    Abstract: In one embodiment, the present invention includes a system-on-a-chip (SoC) with first and second cores, interface logic coupled to the cores, chipset logic coupled to the interface logic, and a virtual firewall logic coupled between the chipset logic and the second core. The interface logic may include a firewall logic, a bus logic, and a test logic, and the chipset logic may include a memory controller to provide for communication with a memory coupled to the SoC. In some system implementations, both during test operations and functional operations, the second core can be disabled during normal operation to provide for a single core SoC, enabling greater flexibility of use of the SoC in many different implementations. Other embodiments are described and claimed.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 16, 2011
    Inventors: Ramana Rachakonda, Lance E. Hacking, Mahesh K. Reddy, Lori R. Borger, Chee Hak Teh, Pawitter P. Bhatia, John P. Lee
  • Publication number: 20110041017
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: August 14, 2009
    Publication date: February 17, 2011
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger