Patents by Inventor Lori Tandy

Lori Tandy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component having dummy segments with trapped corner air
    Patent number: 7265453
    Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: September 4, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Steven L. James, Lori Tandy, legal representative, William D. Tandy, deceased
  • Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
    Patent number: 7186589
    Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: March 6, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Steven L. James, William D. Tandy, deceased, Lori Tandy, legal representative
  • System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
    Patent number: 6969918
    Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: November 29, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Steven L. James, Lori Tandy, legal representative, William D. Tandy, deceased
  • Semiconductor component having dummy segments with trapped corner air
    Publication number: 20050040506
    Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.
    Type: Application
    Filed: September 24, 2004
    Publication date: February 24, 2005
    Inventors: Steven James, William Tandy, Lori Tandy
  • Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
    Publication number: 20050035435
    Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.
    Type: Application
    Filed: September 24, 2004
    Publication date: February 17, 2005
    Inventors: Steven James, William Tandy, Lori Tandy