Patents by Inventor Lorna M. Mitson

Lorna M. Mitson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for pretreating a substrate prior to application of a polymeric coat
    Patent number: 6946407
    Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: September 20, 2005
    Assignee: Micron Technology, Inc.
    Inventors: John T. Davlin, Douglas S. Schramm, Lorna M. Mitson
  • Method for pretreating a substrate prior to application of a polymeric coat
    Patent number: 6784120
    Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: August 31, 2004
    Assignee: Micron Technology, Inc.
    Inventors: John T. Davlin, Douglas S. Schramm, Lorna M. Mitson
  • Method for pretreating a substrate prior to application of a polymeric coat
    Publication number: 20040157471
    Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
    Type: Application
    Filed: February 3, 2004
    Publication date: August 12, 2004
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: John T. Davlin, Douglas S. Schramm, Lorna M. Mitson
  • Methods for pretreating a substrate prior to application of a polymeric coat
    Publication number: 20020168874
    Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
    Type: Application
    Filed: June 28, 2002
    Publication date: November 14, 2002
    Applicant: Micron Technologies, Inc.
    Inventors: John T. Davlin, Douglas S. Schramm, Lorna M. Mitson
  • Method for pretreating a substrate prior to application of a polymeric coat
    Patent number: 6461983
    Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: October 8, 2002
    Assignee: Micron Technology, Inc.
    Inventors: John T. Davlin, Douglas S. Schramm, Lorna M. Mitson