Abstract: A stacking apparatus and method of multi-layer stacking of objects of different sizes on a support to form a stacked support includes providing a support handler. A support is elevated with the support handler and objects of different sizes and shapes are stacked on the support to form a stacked support. A stacked support is removed and an empty support supplied with the support handler. A placeholder is provided above the support handler. The placeholder has a first mode for receiving objects on the placeholder. The placeholder has a second mode for providing access to a support on the support handler. The placeholder is put in the first mode while the support handler removes a stacked support and supplies an empty support. The placeholder is put in the second mode when the support handler is elevating a support being stacked with articles.

Abstract: A stacking apparatus and method of multi-layer stacking of objects of different sizes on a support to form a stacked support includes providing a support handler. A support is elevated with the support handler and objects of different sizes and shapes are stacked on the support to form a stacked support. A stacked support is removed and an empty support supplied with the support handler. A placeholder is provided above the support handler. The placeholder has a first mode for receiving objects on the placeholder. The placeholder has a second mode for providing access to a support on the support handler. The placeholder is put in the first mode while the support handler removes a stacked support and supplies an empty support. The placeholder is put in the second mode when the support handler is elevating a support being stacked with articles.

Abstract: A light-tight laser enclosure system including an enclosure, a robotic laser, first and second pass through partitions, and first and second rotary positioners. The robotic laser is positioned within an interior volume of the enclosure and defines a processing envelope. The first pass through partition defines a first passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the first passage is placed in selective communication with the interior and exterior volumes. The second pass through partition defines a second passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the second passage is placed in selective communication with the interior and exterior volumes. The first and second rotary positioners are configured to secure a workpiece within the first and the second passages, respectively.

Abstract: A workpiece enclosure system of the present invention includes a workpiece loading section, a laser workstation cell, and a workpiece unloading section. The workpiece loading section includes a materials handling robot arranged to move workpieces from an input conveyor to a light-tight pass-through enclosure in communication with the laser workstation cell. The laser workstation cell includes an additional materials handling robot arranged to move workpieces from the pass-through enclosure to one of two dual headstock/tailstock positioners for laser operations. Preferably, two sets of laser-cutting robots are arranged to perform laser-cutting operations on workpieces held by the headstock/tailstock positioners. The materials handling robot is further arranged to move workpieces from the headstock/tailstock positioners to an additional pass-through enclosure in communication with the workpiece unloading section.

Abstract: A workpiece enclosure system of the present invention includes a workpiece loading section, a laser workstation cell, and a workpiece unloading section. The workpiece loading section includes a materials handling robot arranged to move workpieces from an input conveyor to a light-tight pass-through enclosure in communication with the laser workstation cell. The laser workstation cell includes an additional materials handling robot arranged to move workpieces from the pass-through enclosure to one of two dual headstock/tailstock positioners for laser operations. Preferably, two sets of laser-cutting robots are arranged to perform laser-cutting operations on workpieces held by the headstock/tailstock positioners. The materials handling robot is further arranged to move workpieces from the headstock/tailstock positioners to an additional pass-through enclosure in communication with the workpiece unloading section.

Abstract: A light-tight laser enclosure system is provided including an enclosure, a robotic laser, first and second pass through partitions, first and second rotary positioners and a controller. The robotic laser is positioned within an interior volume of the enclosure and defines a processing or operating envelope. The first pass through partition defines a first passage in selective communication with interior and exterior volumes of the enclosure. The first pass through partition is configured to maintain a light-tight configuration as the first passage is placed in selective communication with the interior and exterior volumes of the enclosure. The second pass through partition defines a second passage in selective communication with interior and exterior volumes of the enclosure. The second pass through partition is configured to maintain a light-tight configuration as the second passage is placed in selective communication with the interior and exterior volumes of the enclosure.

Abstract: A real time variable laser beam spinner, wherein a manual or programmable actuator angularly displaces a mirror or optical flat during rotation in order to follow the instantaneous spin diameter requirements associated with a workpiece, whereby a variable effective spin diameter of the beam results without interrupting the work process.