Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.

Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

Abstract: Polysulfide compositions having a polyether synergist are disclosed. Polysulfide compositions that contain polyether synergists exhibit a rapid onset of cure and have acceptable final properties. The polysulfide compositions can be used as sealants.

Abstract: Compositions include a polythiol and a wetted filler. The composition comprises from 0.1 wt % to 10 wt % water based on the total weight of the composition. The compositions exhibit an extended working time and a rapid onset of cure. The compositions can be used as sealants.

Abstract: Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Abstract: Compositions include a polythiol and a wetted filler. The compositions exhibit an extended working time and a rapid onset of cure. The compositions can be used as sealants.

Abstract: Polysulfide compositions having a polyether synergist are disclosed. Polysulfide compositions that contain polyether synergists exhibit a rapid onset of cure and have acceptable final properties. The polysulfide compositions can be used as sealants.

Abstract: Disclosed is a resinous adhesion promoter composition comprising a random copolymer having first and second constitutional monomeric units, the first monomeric units comprising functional groups that promote adhesion to a substrate and the second monomeric units being derived from ethylenically unsaturated monomers and comprising other functional groups that promote adhesion to a substrate.

Abstract: Disclosed are electrodepositable coating compositions that include a cationic amine salt group-containing (meth)acrylic polymer in which the (meth)acrylic polymer is prepared by polymerizing a mixture of ethylenically unsaturated monomers comprising at least 10% by weight of a (meth)acrylic monomer containing hydroxy ester groups, the % by weight being based on total weight of ethylenically unsaturated monomers, and an acid salt of a guanidine or a guanidine reaction product. Associated methods of preparing an amine salt group containing composition and for coating a substrate are also disclosed. Substrates coated with the electrodepositable coating composition are also disclosed.

Abstract: Disclosed herein are cationic electrodepositable coating compositions that are capable of providing cured coatings of low gloss.

Abstract: Disclosed herein are anionic electrodepositable coating compositions that are capable of providing cured coatings of low gloss.

Abstract: A method for coating a segment of pipe is disclosed. The method comprises applying by electrodeposition a coating composition to the segment of pipe wherein the coating composition comprises: (i) a (meth)acrylic polymer dispersed in aqueous medium prepared by polymerizing in the presence of a cationic salt group containing polymeric dispersant a polymerizable ethylenically unsaturated monomer composition comprising a mixture of ethylenically unsaturated monomers at least one of which contains at least two ethylenically unsaturated groups per molecule; (ii) an electrodepositable cationic resinous vehicle containing active hydrogen groups; and (iii) a curing agent reactive with the active hydrogen groups.

Abstract: A method for coating a segment of pipe is disclosed. The method comprises applying by electrodeposition a coating composition to the segment of pipe wherein the coating composition comprises: (i) a (meth)acrylic polymer dispersed in aqueous medium prepared by polymerizing in the presence of a cationic salt group containing polymeric dispersant a polymerizable ethylenically unsaturated monomer composition comprising a mixture of ethylenically unsaturated monomers at least one of which contains at least two ethylenically unsaturated groups per molecule; (ii) an electrodepositable cationic resinous vehicle containing active hydrogen groups; and (iii) a curing agent reactive with the active hydrogen groups.

Abstract: Disclosed are electrodepositable coating compositions that include a cationic amine salt group-containing (meth)acrylic polymer in which the (meth)acrylic polymer is prepared by polymerizing a mixture of ethylenically unsaturated monomers comprising at least 10% by weight of a (meth)acrylic monomer containing hydroxy ester groups, the % by weight being based on total weight of ethylenically unsaturated monomers, and an acid salt of a guanidine or a guanidine reaction product. Associated methods of preparing an amine salt group containing composition and for coating a substrate are also disclosed. Substrates coated with the electrodepositable coating composition are also disclosed.

Abstract: An electrodepositable composition comprising; (a) an active hydrogen-containing, cationic salt group-containing resin, such as a (meth)acrylic sulfonium salt group-containing resin; (b) a capped polyisocyanate curing agent; and (c) a dimethyltin dicarboxylate or dimercaptide, such as dimethyltin dicarboxylate or dimercaptide in which the carboxylate and mercaptide groups contain from 8 to 12 carbon atoms.

Abstract: An electrodepositable composition comprising: (a) an active hydrogen-containing, cationic salt group-containing resin, such as a (meth)acrylic sulfonium salt group-containing resin; (b) a capped polyisocyanate curing agent; and (c) a dialkyltin dicarboxylate or dimercaptide, in which one or both of the alkyl groups contain from 1 to 4 carbon atoms and one or both of the carboxylate and mercaptide groups contain from 8 to 12 carbon atoms.

Abstract: Disclosed herein are anionic electrodepositable coating compositions that are capable of providing cured coatings of low gloss.

Abstract: Disclosed herein are cationic electrodepositable coating compositions that are capable of providing cured coatings of low gloss.