Abstract: A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: A rotatable cover plate assembly 10 has a cavity 13 and a rotatable base plate assembly 12 has a cavity 42 with a semiconductor wafer 14 mounted therein. The cover plate assembly 10 comes down onto the base plate assembly 12 enclosing the semiconductor wafer 14 and a dispenser 28 in a chamber formed by the cavities 13 and 42. The cover and base plates 16 and 40 are rotated as a single assembly, and coating material dispensed by the dispenser 28 onto the semiconductor wafer 14. A flow regulator 25 coupled via an exhaust manifold 20 controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: An electroplating chamber that allows substrates such as wafers to be effectively plated with the plating surface facing upwards. A method of reducing non-uniformity in the electroplating process is also disclosed. The chamber includes a bottom and a cover. The bottom contains a sidewall, an opening on top and securing means for securing substrates into the chamber during the plating process. At least one electrode retaining element is provided having at least one first electrode extending therefrom. The electrode retaining element is movable between an operating position and a release position. The cover contains a second electrode held above the substrate by an electrode holder.