Abstract: A fan module for a soldering system and a soldering system, in particular for a reflow soldering system, for circulating air in a process channel of the soldering system, the module having a housing-like support part, a first shaft bearing provided in or on the support part, a motor, which includes a stator and a rotor which cooperates with the stator, a rotor shaft provided on the rotor, a fan wheel provided on the rotor shaft and having a second shaft bearing for supporting the rotor shaft, wherein the fan module includes a flange plate, which in the assembled state covers a channel opening in the process channel and which includes an aperture in or on which the second shaft bearing is provided.

Abstract: The invention relates to a device for feeding a stream of hot gas to a printed circuit board during convection soldering in a soldering installation. The feed device comprises a nozzle plate (1) having at least one drilled hole (3), which opens into a hot gas nozzle (2) arranged on the nozzle plate (1) and having a nozzle opening (4). The invention is defined in that the hot gas nozzle is formed by a flexible helical spring (2). The invention permits the nozzle plate with the hot gas nozzles to be advanced right up to the printed circuit board under all peripheral conditions which occur. In particular, the printed circuit board can, for instance, be advanced right up to the nozzle plate even when a central support for the printed circuit boards or some other disruptive contour is present.

Abstract: A conveyor device for printed circuit boards includes a carrier that continuously circulates between conveyor wheels. At least one carrier element supporting placement of the printed circuit board and at least one resilient clamping element clamping the printed circuit board on the carrier element are arranged on the carrier. A switching device moves the clamping element back and forth between an open position of the clamping element, in which the printed circuit board can be loosely placed onto the carrier element, and a spring-loaded closed position of the clamping element, in which the printed circuit board can be pressed onto the carrier element by the clamping element.

Abstract: The invention relates to a device for feeding a stream of hot gas to a printed circuit board during convection soldering in a soldering installation. The feed device comprises a nozzle plate (1) having at least one drilled hole (3), which opens into a hot gas nozzle (2) arranged on the nozzle plate (1) and having a nozzle opening (4). The invention is defined in that the hot gas nozzle is formed by a flexible helical spring (2). The invention permits the nozzle plate with the hot gas nozzles to be advanced right up to the printed circuit board under all peripheral conditions which occur. In particular, the printed circuit board can, for instance, be advanced right up to the nozzle plate even when a central support for the printed circuit boards or some other disruptive contour is present.

Abstract: The invention relates to a conveyor device for printed circuit boards (4). The conveyor device comprises a carrier means (1) that continuously circulates between conveyor wheels and is linearly guided in sections. At least one carrier element (2) for supporting placement of the printed circuit board (4) and at least one resilient clamping element (5) for clamping the printed circuit board (4) on said carrier element (2) are arranged on said carrier means (1). By means of a switching device (9), the clamping element (5) can be moved back and forth between an open position of the clamping element (5), in which the printed circuit board (4) can be loosely placed onto said carrier element (2), and a spring-loaded closed position of the clamping element (5), in which the printed circuit board (4) can be pressed onto the carrier element (2) by the clamping element (5).