Abstract: An electroplating device for sheet-like circuit boards characterized by an upper and lower electrode extending on opposite sides of a path for the boards, electrolyte headers being arranged adjacent the inlet and the outlet of the apparatus above and below the path for the boards and wash jets being arranged above the path for discharging electrolyte solution vertically against the boards as they pass therethrough.

Abstract: An electrolysis device for electrolytic deposition of a metal on at least one surface of the tape which has been precoated with a metal provides an electrolytic metal deposition band in which there is a first electrode for connection to a first voltage source. A tape drive is provided for moving the tape through the bath including first guide rollers defining a single loop for the tape through the bath. A second electrode is provided in the tape path and mounted to contact the tape above the entrance to the bath and over an area of the one metallized surface and is connected to a second source potential. Second guide rollers along the tape path downstream of the bath, including a second guide roller contact the metallized surface and is connected to a third source potential.