Patents by Inventor Lothar Haug

Lothar Haug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for soldering microstructured sheet metal
    Patent number: 6220497
    Abstract: In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 &mgr;m. The stack is then soldered by heating it in a vacuum or an inert atmosphere.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: April 24, 2001
    Assignee: Xcellsis GmbH
    Inventors: Uwe Benz, Lothar Haug, Wolfgang Kleinekathoefer, Peter Waitkat