Abstract: An automatic SMD equipping unit utilizes a rotatable and displaceable multiple equipping head (1) with plural suction pipettes (2) and a device carrier (7) that contains processing stations (8). The multiple equipping head (1) executes a collecting event via delivery units (4) whereby it picks up components. The equipping of the printed circuit board (5) from the equipping head occurs in a second procedure, whereby the multiple equipping head (1) need not move back and forth between delivery unit (4) and printed circuit board (5) after every placement of a component (3) onto the printed circuit board (5). The components that were picked up by the suction pipettes (2) are processed by processing stations (8) after the collecting and before the equipping. Here, the components are centered, contacted, measured and tested.