Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

Abstract: A modular electronic system having cooling means has a plurality of stacked electronic circuit units. Each stackable circuit unit has a rectangular frame having a pair of end members which support a plurality of spaced-apart, cooling channels. A cooling passageway extends through each channel along the length thereof and communicates with a cavity in each end member. The cavities form integral entrance and exit plenums for a fluid coolant when a plurality of the circuit units are stacked and aligned. A plurality of dual in line packages or other discrete electronic circuit packages are thermally coupled to one side of the channels with the leads from the packages extending between the channels to the other side thereof where they are connected by wave soldering to a printed circuit board. The individual circuit units are electrically interconnected by male contacts on a transverse member of the frame which cooperate with female contacts on electrical connection boards.

Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.