Abstract: A valve has a plurality of material inlet ports, a flushing inlet port, and an outlet port each connected to a respective supply of one of last two different liquid materials. A movable valve body in the valve has a passage and is shiftable between a plurality of positions in each of which a respective one of the inlet ports is connected to the outlet port via the passage. A controller moves the valve body between the positions such that, after each time the valve body is in a position connecting one of the material inlet ports to the outlet port and material has passed through the passage, the valve body is moved into a position connecting the passage with the flushing inlet port for flushing out the passage.

Abstract: A valve has a plurality of material inlet ports, a flushing inlet port, and an outlet port each connected to a respective supply of one of last two different liquid materials. A movable valve body in the valve has a passage and is shiftable between a plurality of positions in each of which a respective one of the inlet ports is connected to the outlet port via the passage. A controller moves the valve body between the positions such that, after each time the valve body is in a position connecting one of the material inlet ports to the outlet port and material has passed through the passage, the valve body is moved into a position connecting the passage with the flushing inlet port for flushing out the passage.

Abstract: An injection molding apparatus is used for making parts having a hollow portion that is disposed under an angle relative to an axis. The molded parts are ejected when a movable stripper plate is displaced relative to the mold core used to cool the angled portion of the molded part. The stripper plate includes cooling channels and a cooling outlet. The cooling outlet is coupled to a cooling inlet of a movable cooling slider element. Leakage of a cooling fluid is prevented by using a sealing device and sealing elements between the cooling slider and a cooling manifold retaining the mold cores when the stripper plate is used during the ejection of the molded parts from the mold cores.

Abstract: An injection molding apparatus is used for making parts having a hollow portion that is disposed under an angle relative to an axis. The molded parts are ejected when a movable stripper plate is displaced relative to the mold core used to cool the angled portion of the molded part. The stripper plate includes cooling channels and a cooling outlet. The cooling outlet is coupled to a cooling inlet of a movable cooling slider element. Leakage of a cooling fluid is prevented by using a sealing device and sealing elements between the cooling slider and a cooling manifold retaining the mold cores when the stripper plate is used during the ejection of the molded parts from the mold cores.

Abstract: The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of: (A) applying a porous layer of at least one semiconductive metal oxide to a substrate, (B) treating the porous layer from step (A) with a solution comprising at least one precursor compound of the semiconductive metal oxide, such that the pores of the porous layer are at least partly filled with this solution and (C) thermally treating the layer obtained in step (B) in order to convert the at least one precursor compound of the semiconductive metal oxide to the semiconductive metal oxide, wherein the at least one precursor compound of the at least one semiconductive metal oxide in step (B) is selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of mono-, di- or polycarboxylic acids, alkoxides, hydroxides, semicarbazides, carbamates, hydroxamates, isocyanates,

Abstract: The invention relates, among other items, to a device (10) with a plurality of inlets (27a, 27b, 27c, 27d, 27e, 27f) and one outlet (19), wherein each of the inlets (27a, 27b, 27c, 27d, 27e, 27f) can be connected to a material supply container (13a, 13b, 13c, 13d, 13e, 13f). An actuator (12) that can be displaced relative to the inlets and has a through-channel (42) is furnished in order to provide a switchable connection between one of the plurality of inlets and the outlet. A communicative connection can be created between the through-channel and one of the various inlets in order to allow various materials to be successively supplied to the outlet. One of the characteristic features is that at least one of the inlets (28) is designed as a flushing medium inlet of a flushing device (47) and that, as a result of the actuator (12) being displaced, a communicative connection can be created between the through-channel (42) and the flushing medium inlet for the purposes of flushing the through channel.

Abstract: The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of: (A) preparing a solution comprising at least one precursor compound of the at least one metal oxide selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms, or derivatives of mono-, di- or polycarboxylic acids, alkoxides, hydroxides, semicarbazides, carbamates, hydroxamates, isocyanates, amidines, amidrazones, urea derivatives, hydroxylamines, oximes, urethanes, ammonia, amines, phosphines, ammonium compounds, azides of the corresponding metal and mixtures thereof, in at least one solvent, (B) applying the solution from step (A) to the substrate and (C) thermally treating the substrate from step (B) at a temperature of 20 to 200° C.

Abstract: The present invention relates to particles which have been modified by a modifier and a dispersion medium comprising the modified particles.

Abstract: The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of: (A) applying a porous layer of at least one semiconductive metal oxide to a substrate, (B) treating the porous layer from step (A) with a solution comprising at least one precursor compound of the semiconductive metal oxide, such that the pores of the porous layer are at least partly filled with this solution and (C) thermally treating the layer obtained in step (B) in order to convert the at least one precursor compound of the semiconductive metal oxide to the semiconductive metal oxide, wherein the at least one precursor compound of the at least one semiconductive metal oxide in step (B) is selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of mono-, di- or polycarboxylic acids, alkoxides, hydroxides, semicarbazides, carbamates, hydroxamates, isocyanates, am

Abstract: The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of: (A) preparing a solution comprising at least one precursor compound of the at least one metal oxide selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms, or derivatives of mono-, di- or polycarboxylic acids, alkoxides, hydroxides, semicarbazides, carbamates, hydroxamates, isocyanates, amidines, amidrazones, urea derivatives, hydroxylamines, oximes, urethanes, ammonia, amines, phosphines, ammonium compounds, azides of the corresponding metal and mixtures thereof, in at least one solvent, (B) applying the solution from step (A) to the substrate and (C) thermally treating the substrate from step (B) at a temperature of 20 to 200° C.

Abstract: The present invention relates to particles which have been modified by a modifier and a dispersion medium comprising the modified particles.

Abstract: A spark plug having an electrode connected via a terminal stud to an ignition lead and having a resistor arranged between the electrode and the ignition lead, the resistor having increased temperature resistance.

Abstract: To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a substrate. To provide a metal plated powder, a powder is nucleated with a noble metal salt and the nucleation is coated with a metal layer. A method is also provided for nucleating the powder surface with a noble metal salt in such a manner that it is chemically bound to the substrate and then metal plated by a conventional electroless method.

Abstract: The invention essentially relates to the use of ceramic powders whose surface has been rendered hydrophobic to produce fine-particle dispersions having a high solids content and a low viscosity. The invention further relates to specific ceramic powders whose surface has been rendered hydrophobic, and methods of producing them. Ceramic powders whose oxidic surface has hydroxide groups possessing a basic or amphoteric character can be rendered hydrophobic, for example, through the effect of a hydrophobic carboxylic acid. Acidic oxides are rendered hydrophobic through treatment with metal-containing hydrophobing agents which are, however, also suitable for rendering ceramic powders hydrophobic that have a basic or amphoteric character.

Abstract: A ceramic layer system including at least two layers having respective ion conductivities which are substantially different includes a substrate layer composed of a ceramic material and having substantially no ion conductivity; and at least one conducting layer positioned adjacent to the substrate layer, containing coated ceramic particles composed of ceramic particles composed of a ceramic material having no substantial ion conductivity which are coated with a material having a substantial ion conductivity so that each conducting layer of the at least one conducting layer has a continuous phase after sintering composed of the material which has a substantial ion conductivity and so that the at least one conducting layer has an ion conductivity effective to conduct ions.

Abstract: A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.

Abstract: A spark plug for igniting fuel/air mixtures in internal combustion engines, in particular in internal combustion engines of motor vehicles. On its insulating-body foot, the spark plug has a coating which is intended to protect against misfirings and cold-starting difficulties as a consequence of electrically conductive deposits, in particular in the case of installation of spark plugs in new motor vehicles. The coating includes solvent-free silicone rubber or silicone resin. The silicone rubber may contain filler and is provided with silicone oil for the purpose of good processability. Expediently, the inner side of the metal housing which is exposed to the combustion chamber is also covered with the coating. The coating is physiologically safe, environmentally acceptable and resistant to handling, and does not require expensive extraction systems if it is sprayed onto the appropriate region of the spark plug by means of nozzles.

Abstract: A method of planarizing trench-like structures, particularly on semiconductor substrates, by filling in the trench-like structures. For this purpose, a pre-polymer is selectively filled into the trench-like structures, is hardened and is then expanded.

Abstract: A pigment is mixed with an epoxy resin or varnish binder in a weight ratio from 5:1 to 6:1 to make a paste, which is then applied as a thin layer by screen printing on top of the counterelectrode layer previously baked onto a metal substrate. In another baking step the new layer for producing a reflective coating is heated to between 120.degree. and 180.degree. C., in which temperature range the binder produces small bubbles before hardening, so that the layer that is produced is permeable to ions when the layer becomes soaked with electrolyte in the assembled electrochromic device. The metal substrate is shaped by drawing to provide the electrolyte cavity after the application of the counterelectrode and the reflecting background layer thereon, since the deformation does not damage either of these layers.

Abstract: A screen-printing paste containing Cu.sub.2 O or NiO and preferably aluminum oxide or, more preferably, an aluminum compound such as aluminum acetylacetonate which forms aluminum oxide under calcination heat, is printed over an entire surface of a substrate consisting of aluminum oxide ceramic, after which it is calcined in air at from 800.degree. to 1350.degree. C. to produce an adhesion-promoting spinel layer. That layer is then metallized by plating in an electroless bath for deposition of copper or nickel, as the case may be, after which the metal layer thus deposited is reinforced galvanically.