Abstract: Disclosed herein are compositions comprising an epoxy-functional polyester, elastomeric particles, and an accelerator. The epoxy-functional polyester comprises a reaction product of a reaction mixture comprising a polyester, a ring-fused anhydride, and an epoxy. The compositions may comprise a sag control agent. Also disclosed are methods of coating a substrate comprising contacting a surface of the substrate with one of the compositions and substrates comprising a coating on a surface thereof, wherein the coating, in an at least partially cured state, has: an impact resistance at 23° C. and/or at ?40° C. of greater than 10 N/mm measured according to ISO 11343 using 0.8 mm thick CRS: a lap shear strength of greater than 12 MPa measured according to ASTM D1002 using 0.8 mm thick hot-dip galvanized steel: and/or a T-peel strength at room temperature of at least 4 N/mm measured according to ASTM D1876 using 0.8 mm thick hot-dip galvanized steel.

Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 µm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Abstract: Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is substantially free of a reactive functional group. The epoxide-functional polymer may be a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 ?m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 ?m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Abstract: Disclosed herein is an adhesive composition that includes a resin composition and an epoxy-containing compound. The resin composition includes an epoxidized polysulfide and an epoxidized oil. The epoxidized polysulfide is present in the adhesive composition in a weight ratio to the epoxidized oil of 20:1 to 1:1. Also disclosed is the adhesive composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the adhesive composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the adhesive composition in an at least partially cured state.

Abstract: Disclosed herein are systems for treating a substrate. The system may include a cleaner composition, a deoxidizing composition comprising a Group IVA metal and/or a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0, and/or a seal composition. The system may also include a coating composition. The cleaner composition, deoxidizing composition, and/or seal composition may comprise a homopolymer or a copolymer comprising a phosphorous-containing monomeric subunit m1. Also disclosed is a deoxidizing composition comprising a Group IVA metal and a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0. Also disclosed are methods of treating a substrate. Also disclosed are treated substrates.

Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 ?m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.