Abstract: The present disclosure concerns a system and associated method for welding a piece. The system includes a 6-axis welding robot including a robotized arm, a vision module and a computing device. The vision module is mounted to a fourth axis of the robotized arm and includes optical sources and a camera. The optical sources are operable to irradiate the piece along irradiation paths. The camera is configured to receive irradiated light from the piece and to generate image data. The computing device is operatively connected to the camera and includes non-transitory computer readable storage medium having stored instructions that, when executed by a processor causes the processor to receive the image data; obtain a reference welding path to be followed by the welding robot for welding the piece; send instructions to the welding robot to weld the piece according to the reference welding path.

Abstract: A shadow-free 3D and 2D measurement system combining, in one FMI set-up, a Moiré 3D lighting with other simultaneous external illuminations (for example a coaxial one or another). The reconstructed image combines the advantages of these different illuminations. The relative light intensities are selected in order to assure the best 2D detection while maintaining the 3D measurements.

Abstract: A method and a system for detecting surface defects on electronic circuits, such as Printed Circuit Boards (PCB), are described herein. The method first comprises identifying contours on a digital image of the PCB. Then anomalies are detected on the PCB image by comparing the identified contours to contours on a vectorial model of the PCB. Each detected anomaly is compared to manufacturing data to verify if it corresponds to a defect.

Abstract: A shadow-free 3D and 2D measurement system combining, in one FMI set-up, a Moiré 3D lighting with other simultaneous external illuminations (for example a coaxial one or another). The reconstructed image combines the advantages of these different illuminations. The relative light intensities are selected in order to assure the best 2D detection while maintaining the 3D measurements.

Abstract: A method and a system for detecting surface defects on electronic circuits, such as Printed Circuit Boards (PCB), are described herein. The method first comprises identifying contours on a digital image of the PCB. Then anomalies are detected on the PCB image by comparing the identified contours to contours on a vectorial model of the PCB. Each detected anomaly is compared to manufacturing data to verify if it corresponds to a defect.