Patents by Inventor Louis CAILLARD

Louis CAILLARD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolyte and Deposition of a Copper Barrier Layer in a Damascene Process
    Publication number: 20230282485
    Abstract: The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the copper. A thin barrier layer is formed by annealing the deposited copper alloy, which causes manganese or zinc to migrate to the interface between the insulating dielectric material and the copper.
    Type: Application
    Filed: July 5, 2021
    Publication date: September 7, 2023
    Inventors: Louis Caillard, Paul Blondeau
  • Process for electrodeposition of cobalt
    Patent number: 11384445
    Abstract: The present invention relates to a process for the fabrication of cobalt interconnections and to an electrolyte which enables the implementation thereof. The electrolyte which has a pH below 4.0 comprises cobalt ions, chloride ions and at most two organic additives of low molecular weight. One of these additives may be an alpha-hydroxy carboxylic acid or a compound having a pKa value ranging from 1.8 to 3.5.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: July 12, 2022
    Assignee: aveni
    Inventors: Vincent Mevellec, Dominique Suhr, Mikailou Thiam, Louis Caillard
  • ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS
    Publication number: 20220090283
    Abstract: Electrodeposition of a cobalt or copper alloy, and use in microelectronics The present invention relates to a process for fabricating cobalt or copper interconnects, and to an electrolyte enabling implementation of said process. The electrolyte, with a pH of less than 4.0, comprises cobalt or copper ions, chloride ions, manganese or zinc ions, and at most two organic additives of low molecular mass. One of these additives may be an alpha-hydroxy carboxylic acid.
    Type: Application
    Filed: February 6, 2020
    Publication date: March 24, 2022
    Inventors: Vincent MEVELLEC, Louis CAILLARD, Mikaïlou THIAM, Dominique SUHR
  • PROCESS FOR ELECTRODEPOSITION OF COBALT
    Publication number: 20210079547
    Abstract: The present invention relates to a process for the fabrication of cobalt interconnections and to an electrolyte which enables the implementation thereof. The electrolyte which has a pH below 4.0 comprises cobalt ions, chloride ions and at most two organic additives of low molecular weight. One of these additives may be an alpha-hydroxy carboxylic acid or a compound having a pKa value ranging from 1.8 to 3.5.
    Type: Application
    Filed: March 15, 2019
    Publication date: March 18, 2021
    Inventors: Vincent MEVELLEC, Dominique SUHR, Mikailou THIAM, Louis CAILLARD