Abstract: Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.

Abstract: Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.

Abstract: Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.

Abstract: Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.

Abstract: Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.

Abstract: Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.

Abstract: A light-transmitting pane for displaying an image of a head-up display is provided. The light-transmitting pane includes a cholesteric liquid-crystal layer arrangement, which is arranged in the interior of the pane or is arranged on a surface of the pane. Depending on the polarization of the incident light, at least a portion of the light generated by an image generating device of a head-up display arrangement can be reflected on the cholesteric liquid-crystal layer arrangement such that the reflected light has a p-polarized fraction, which can be perceived through polarized sunglasses.

Abstract: A light-transmitting pane for displaying an image of a head-up display is provided. The light-transmitting pane includes a cholesteric liquid-crystal layer arrangement, which is arranged in the interior of the pane or is arranged on a surface of the pane. Depending on the polarization of the incident light, at least a portion of the light generated by an image generating device of a head-up display arrangement can be reflected on the cholesteric liquid-crystal layer arrangement such that the reflected light has a p-polarized fraction, which can be perceived through polarized sunglasses.

Abstract: A polyethylene resin comprising from 35 to 49 wt. % of a first polyethylene fraction of high molecular weight and from 51 to 65 wt. % of a second polyethylene fraction of low molecular weight, the first polyethylene having a density of up to 0.930 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3 and an MI2 of greater than 10 g/10 min, and the polyethylene resin, having a density of greater than 0.946 g/cm3, an HLMI of from 1 to 100 g/10 min, a dynamical viscosity, measured at 0.01 radians/second, greater than 200,000 Pa·s and a ratio of the dynamical viscosities measured at, respectively 0.01 and 1 radians/second greater than 8.

Abstract: A polyethylene resin comprising a blend of from 35 to 49 wt % of a first polyethylene fraction of high molecular weight and 51 to 65 wt % of a second polyethylene fraction of low molecular weight, the first polyethylene fraction comprising a linear low density polyethylene having a density of up to 0.928 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3, and an MI2 of greater than 100 g/10 min, and the polyethylene resin, having a density of greater than 0.951 g/cm3 and an HLMI of from 1 to 100 g/10 min.

Abstract: A polyethylene resin comprising from 35 to 49 wt. % of a first polyethylene fraction of high molecular weight and from 51 to 65 wt. % of a second polyethylene fraction of low molecular weight, the first polyethylene having a density of up to 0.930 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3 and an MI2 of greater than 10 g/10 min, and the polyethylene resin, having a density of greater than 0.946 g/cm3, an HLMI of from 1 to 100 g/10 min, a dynamical viscosity, measured at 0.01 radians/second, greater than 200,000 Pa.s and a ratio of the dynamical viscosities measured at, respectively 0.01 and 1 radians/second greater than 8.

Abstract: A polyethylene resin comprising from 35 to 49 wt. % of a first polyethylene fraction of high molecular weight and from 51 to 65 wt. % of a second polyethylene fraction of low molecular weight, the first polyethylene having a density of up to 0.930 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3 and an MI2 of greater than 10 g/10 min, and the polyethylene resin, having a density of great 0.946 g/cm3, an HLMI of from 1 to 100 g/10 min, a dynamical viscosity, measured at 0.01 radians/second, greater than 200,000 Pa.s and a ratio of the dynamical viscosities measured at, respectively 0.01 and 1 radians/second greater than 8.

Abstract: A fashion doll stand for single-legged support of a fashion doll comprising a Shaped Base having a flush underside with a center of gravity, and a hollow Tapered Support joined perpendicular to said Shaped Base through the center of gravity. The single-legged doll stand does not clamp or clip the leg of the doll in any way, but simply allows free insertion/removal of one leg or the other to provide a full range of posability of the fashion doll in a supported position. It also ensures sturdy two point support: 1) full orthogonal support around the mid-to-upper calf; and 2) lateral stabilization support at the ball of the foot; thereby providing excellent lateral, horizontal and rotational stability for the fashion doll in a variety of upright positions.

Abstract: The flexible compositions having no elastomeric fractions comprise: A) from 10 to 90 parts by weight of random copolymer of propylene and at least one comonomer selected from ethylene and C4-C8 alpha-olefins having a melting point of at least 100° C. and not exceeding 140° C. and a flow index measured at 230° C. under a weight of 2.16 kg (ASTM standard D1238, 1986) of from 0.5 to 15 g/10 min, and B) from 90 to 10 parts by weight of plastomer prepared with participation of a metallocene catalyst and consisting of a random copolymer of ethylene and at least one C3-C10 alpha-olefin having a density of from 0.860 to 0.920 g/cm3, a melt flow index measured at 190° C. under a weight of 2.16 kg (ASTM standard D1238, 1986) of from 0.5 to 30 g/10 min, and a molecular mass distribution Mw/Mn of at most 4. These compositions provide an excellent compromise between flexibility and low-temperature impact resistance and heat resistance.

Abstract: A polyethylene resin comprising a blend of from 35 to 49 wt % of a first polyethylene fraction of high molecular weight and 51 to 65 wt % of a second polyethylene fraction of low molecular weight, the first polyethylene fraction comprising a linear low density polyethylene having a density of up to 0.928 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3, and an MI2 of greater than 100 g/10 min, and the polyethylene resin, having a density of greater than 0.951 g/cm3 and an HLMI of from 1 to 100 g/10 min.

Abstract: A polyethylene resin comprising from 35 to 49 wt. % of a first polyethylene fraction of high molecular weight and from 51 to 65 wt. % of a second polyethylene fraction of low molecular weight, the first polyethylene having a density of up to 0.930 g/cm3, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm3 and an MI2 of greater than 10 g/10 min, and the polyethylene resin, having a density of greater than 0.946 g/cm3, an HLMI of from 1 to 100 g/10 min, a dynamical viscosity, measured at 0.01 radians/second, greater than 200,000 Pa.s and a ratio of the dynamical viscosities measured at, respectively 0.01 and 1 radians/second greater than 8.

Abstract: Catalyst support containing an &agr;-olefin polymer which is in the form of particles of mean size from 5 to 350 &mgr;m in which the pore volume generated by the pores of radius from 1,000 to 75,000 Å is at least 0.2 cm3/g. Catalyst usable for the polymerization of &agr;-olefins, including a compound containing at least one transition metal belonging to groups IIIb, IVb, IVb and VIb of the Periodic Table, bound in or on this support.

Abstract: Catalyst support containing an &agr;-olefin polymer which is in the form of particles of mean size from 5 to 350 &mgr;m in which the pore volume generated by the pores of radius from 1,000 to 75,000 Å is at least 0.2 cm3/g.

Abstract: The invention comprises a catalyst support containing an &agr;-olefin polymer which is in the form of particles of mean size from 5 to 350 &mgr;m in which the pore volume generated by the pores of radius from 1,000 to 75,000 Å is at least 0.2 cm3/g. A catalyst usable for the polymerization of &agr;-olefins, including a compound containing at least one transition metal belonging to groups IIIb, IVb, IVb and VIb of the Periodic Table, bound in or on this support, is also described.

Abstract: Catalytic system which can be used for the polymerisation of .alpha.-olefins comprising:a solid based on complexed titanium trichloride of .delta. crystalline form;an organoaluminium compound;an organic oxygenated silicon compound; characterised in that the organoaluminium compound is a non-halogenated compound.