Patents by Inventor Louis D. Laozerotti

Louis D. Laozerotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080124883
    Abstract: A structure comprises a single wafer with a first subcollector formed in a first region having a first thickness and a second subcollector formed in a second region having a second thickness, different from the first thickness. A method is also contemplated which includes providing a substrate including a first layer and forming a first doped region in the first layer. The method further includes forming a second layer on the first layer and forming a second doped region in the second layer. The second doped region is formed at a different depth than the first doped region. The method also includes forming a first reachthrough in the first layer and forming a second reachthrough in second layer to link the first reachthrough to the surface.
    Type: Application
    Filed: November 16, 2007
    Publication date: May 29, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION,
    Inventors: Douglas D. COOLBAUGH, Alvin J. Joseph, Seong-dong Kim, Louis D. Laozerotti, Xuefeng Liu, Robert M. Rassel